Feed structure, millimeter wave antenna and automobile

A feeding line and feeding technology, applied in leaky waveguide antennas, antennas, antenna grounding devices, etc., can solve difficult problems such as large bandwidth and low loss, high matching difficulty, and large reflection loss

Pending Publication Date: 2021-10-29
HISENSE GRP HLDG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The feeding structure of SIW (Substrate integrated waveguide, substrate integrated waveguide) antenna in the prior art is difficult to match, and the reflection loss is relatively large, especially in the millimeter wave field, it is difficult to achieve large bandwidth and low loss

Method used

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  • Feed structure, millimeter wave antenna and automobile
  • Feed structure, millimeter wave antenna and automobile
  • Feed structure, millimeter wave antenna and automobile

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Embodiment Construction

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] First, as Figure 1 to Figure 6 As shown, an embodiment of the present invention provides a feed structure 100, including: a first metal layer 110, a dielectric substrate 120, and a second metal layer 130 that are stacked in sequence, and the dielectric substrate 120 is provided with at least two rows of first conductive The through hole group 140 is used to connect the first metal layer 110 and the second metal layer 130 to fo...

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Abstract

The invention relates to the field of antennas, and discloses a feed structure, a millimeter wave antenna and an automobile. The feed structure comprises a first metal layer, a dielectric substrate and a second metal layer which are stacked in sequence, wherein the dielectric substrate is provided with at least two rows of first conductive through hole groups which are used for connecting the first metal layer and the second metal layer to form a substrate integrated waveguide structure; the first metal layer is provided with a feeder line connected with the substrate integrated waveguide structure; and the second metal layer is provided with a first gap used for exposing the dielectric substrate, and the first gap is provided with a coupling matching structure matched with the feeder line. The coupling matching structure is matched with the feeder line of the substrate integrated waveguide structure to realize signal coupling, so that the SIW antenna matching problem in the prior art is improved, and the insertion loss is reduced.

Description

technical field [0001] The present invention relates to the technical field of antennas, in particular to a feeding structure, a millimeter wave antenna and an automobile. Background technique [0002] Substrate integrated waveguide (SIW) is a new form of microwave transmission line, which utilizes metal vias to realize the field propagation mode of the waveguide on the dielectric substrate. The feeding structure of the SIW (Substrate integrated waveguide, substrate integrated waveguide) antenna in the prior art is difficult to match, and the reflection loss is relatively large, especially in the millimeter wave field, it is difficult to achieve large bandwidth and low loss. SUMMARY OF THE INVENTION [0003] The invention discloses a feeding structure, a millimeter wave antenna and an automobile, which are used for improving the matching problem of the SIW antenna in the prior art and reducing the insertion loss. [0004] For achieving the above object, the present invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/50H01Q1/32H01Q1/48H01Q1/36H01Q13/20
CPCH01Q1/50H01Q1/32H01Q1/48H01Q1/36H01Q13/206
Inventor 高修东王海亮王冲张燎王绍龙
Owner HISENSE GRP HLDG CO LTD
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