Heat transport device and electronic apparatus

Abstract

Provided are a heat transport device and an electronic apparatus which exhibit good heat dissipation properties and do not apply stress to a heat generating element. The heat transport device (11) includes: a sub heat sink (40) which extends along a surface of a main board (20) on which a chip (34) is mounted, and has a sheet mounting hole (42) formed in a portion including the chip (34) as observed in plan view; a main heat sink (38) which extends along a back surface (20b) opposite from the mounting surface (20a) and is in thermal contact at a position on the back surface (20b) that corresponds to the chip (34); a sheet member (44) which is installed to the sub heat sink (40) in such a manner as to close the sheet mounting hole (42) and has thermal conductivity; a bracket (48) which is fixed to the main board (20) and covers the sheet mounting hole (42); and a resin elastic member (50) sandwiched between the sheet member (44) and the bracket (48) while being elastically compressed. The sheet member (44) is in thermal contact with a surface of the chip (34) and has lower rigidity than the sub heat sink (40). The sheet member (44) is a graphite sheet.

Description

Technical field [0001] The present invention relates to a heat transfer device that delivers a heat generating body and an electronic device including the heat transfer device. Background technique [0002] In the electronic device, heating heat is provided in the electronic device, and heat dissipation is required according to its power consumption. In the Patent Document 1 discloses the invention that is disconnected by the heat dissipating plate to make the heat generated in the CPU. The heat dissipation plate of Patent Document 1 is a plate comprising a thermally conductive tube and a heat sink and is in contact with the upper surface of the CPU. [0003] On the other hand, the notebook PC, the tablet terminal, etc. carrying electronic devices require minimalization and thinning. In carrying electronics, a POP (Package On Package: laminated package) structure is considered for the miniaturization of the primary substrate. In the POP structure, for example, the mounting area c...

AI Technical Summary

Problems solved by technology

However, if the contact is too strong, the heating element may be damaged

[0009] In particular, the lower sub-package and the upper sub-package of the PoP structure package are only connected by solder balls, and the mechanical strength is not necessarily high. If the heat sink is pressed strongly against the surface, the solder balls may be damaged due to stress.

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