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Novel surface-mounted lamp bead structure and packaging process thereof

A patch and lamp bead technology, which is applied in the field of lighting, can solve the problems of unshaped light spots, uneven light mixing, and high manufacturing costs, and achieve the effects of excellent light spot effects, expanded application range, and less brightness error

Pending Publication Date: 2021-11-02
沈金山
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

When the above two kinds of SMD lamp beads are used on spotlights and other lamps that are reflected by reflectors or refracted by lenses, either the spots are irregular in single-color lighting, the mixed light is uneven in two-color lighting, and the spots are not formed. The cost is high, and the light mixing effect still has room for improvement

Method used

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  • Novel surface-mounted lamp bead structure and packaging process thereof
  • Novel surface-mounted lamp bead structure and packaging process thereof
  • Novel surface-mounted lamp bead structure and packaging process thereof

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Embodiment Construction

[0031] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings. It should be noted here that the descriptions of these embodiments are used to help understand the present invention, but are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not constitute a conflict with each other.

[0032] Such as Figure 1 to Figure 3 As shown, a new type of patch lamp bead structure, including a patch bracket 1, a first LED chip 2, a second LED chip 3 and a bowl cup 4, the center of the patch bracket 1 is provided with at least one first LED chip 2. At least one first LED chip 2 is surrounded by at least three second LED chips 3. The bowl cup 4 is set on the patch bracket 1 and at least one first LED chip 2 and at least three second LED chips Surrounded by LED c...

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Abstract

The invention discloses a novel surface-mounted lamp bead structure and a packaging technology thereof. The novel surface-mounted lamp bead structure comprises a surface-mounted support, a first LED chip, a second LED chip and a bowl cup. The packaging technology comprises the steps of S1 die bonding, S2 baking, S3 wire welding, S4 first color temperature fluorescent glue precise dispensing to make the first color temperature fluorescent glue only cover the first LED chip and do not affect the second LED chip, S5 baking, S6 second color temperature fluorescent glue filling to make the second LED chip and the first color temperature fluorescent glue filled and covered with a layer of second color temperature fluorescent glue, S7 baking, S8 long baking, S9 stripping, S10 light splitting, S11 braiding, and S12 packaging. When the lamp bead is used for single-color and double-color mixed light illumination, uniform and symmetrical light is uniformly and symmetrically emitted from the center of the patch bracket, and light spots are regularly formed in cooperation with secondary light emission after refraction of a condensing lens of a lamp and reflection of a reflection cup, so the double-color-temperature mixed light gradual change is more uniform and the boundary is soft during light and color modulation, and the application range of the small-size lamp bead is expanded.

Description

technical field [0001] The invention relates to the field of lighting technology, in particular to a novel patch lamp bead structure and packaging process. Background technique [0002] The size of the LED chips in the light-emitting area of ​​the existing small-sized dual-color temperature lamp beads with a size of 5.5mm*5.5mm and below is generally 0.3-3.5mm 2 , using the existing glue-filling packaging process, only the entire light-emitting area can be filled with glue, and the SMD lamp beads of the glue-filling package include the following two types: a symmetrical light-emitting area with several LED chips is arranged on a small-sized patch bracket , the light-emitting areas are filled with two-color temperature fluorescent glue, or the two-color temperature LED chips are staggered along the center circumference of the patch bracket on the patch bracket, and then the two-color temperature LED chips are filled with glue to make the hemispherical transparent sealant. Wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/62F21V9/38F21V19/00F21Y115/10
CPCH01L25/0753H01L33/48H01L33/50H01L33/508H01L33/62F21V19/0025F21V19/002F21V9/38H01L2933/0033H01L2933/0041H01L2933/0066F21Y2115/10
Inventor 沈金山
Owner 沈金山
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