High-speed multifunctional automatic chip mounting method
An automatic patch and multi-function technology, applied in the direction of electrical components, electrical components, electrical components assembly printed circuit, etc., can solve the problems of inconvenient collection, inconvenient cooling work, inconvenient material arrangement, etc., to achieve convenient Organize and transport work, increase the effect of cooling function
Inactive Publication Date: 2021-11-05
惠州市夏瑞科技有限公司
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Problems solved by technology
[0005] In order to solve the above-mentioned technical problems, the present invention provides a high-speed multi-functional automatic patching method to solve the problem that the existing patching method is inconvenient to carry out material sorting work during use, and it is inconvenient to carry out Cooling work after patching and inconvenient collection during use
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[0030] The present invention is described in detail below in conjunction with accompanying drawing, as appended figure 1 , with figure 2 And attached image 3 and attached Figure 4 As shown, a high-speed multi-functional automatic placement equipment includes a base 1, a placement machine body 2, a support block 3, a conveying mechanism 4, an inverted U-shaped bracket 5, a moving placement head mechanism 6, a buffer box 7, and a push rod 8. Corresponding to the plate 9 and the hand-held rod 10, the main body 2 of the placement machine is bolted to the upper middle position of the base 1; The middle position of the upper end is behind the left side; the upper end of the support block 3 is respectively bolted to the front and rear of the lower end of the conveying mechanism 4; the lower end of the inverted U-shaped bracket 5 is respectively bolted to the upper end of the chip mounter body 2 The middle position on the left and right sides; the moving placement head mechanism...
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The invention provides a high-speed multifunctional automatic surface mounting device. The high-speed multifunctional automatic surface mounting device comprises a base, a surface mounting machine main body, a supporting block, a conveying mechanism, an inverted U-shaped bracket, a movable surface mounting head mechanism, a buffer box, a push rod, a corresponding plate and a handheld rod. The invention discloses a high-speed multifunctional automatic chip mounting method, and the method comprises the steps of arranging the materials and the workpieces, adjusting a device to convey the materials, correspondingly mounting the materials needing to be mounted, and cooling, collecting and moving the installed workpiece. According to the present invention, in the surface mounting process, the surface-mounted workpieces driven by a conveying mechanism 4 are subjected to wind power cooling work through a wind power cooling device arranged behind the upper end of the conveying mechanism 4, so that the cooling work can be conveniently carried out in the using process, and a cooling function is added.
Description
technical field [0001] The invention belongs to the technical field of placement equipment, in particular to a high-speed multifunctional automatic placement method. Background technique [0002] Mounter, also known as "mounter", "surface mount system", in the production line, it is configured after the dispenser or screen printing machine, it is to place the surface mount components accurately by moving the placement head A device on the PCB pad, the placement machine is an automatic placement device used in the production of SMT. [0003] However, the existing patching method still has the problems of inconvenient material arrangement during use, inconvenient cooling after patching and inconvenient collection during use. [0004] Therefore, it is very necessary to invent a kind of high-speed multifunctional automatic placement method. Contents of the invention [0005] In order to solve the above-mentioned technical problems, the present invention provides a high-speed...
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IPC IPC(8): H05K13/04H05K3/30
Inventor 周虎雄
Owner 惠州市夏瑞科技有限公司