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Automatic ultrasonic cleaning device for semiconductor chemical mechanical grinding precision part

An ultrasonic cleaning and chemical-mechanical technology, applied in the direction of cleaning methods using liquids, chemical instruments and methods, cleaning methods and utensils, etc., can solve problems such as difficulty in placing parts and poor cleaning effect, achieve quality control and improve work. Efficiency and ease of use

Pending Publication Date: 2021-11-09
富乐德科技发展(大连)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problems of difficulty in placing parts and poor cleaning effect in the prior art, this application provides an automatic ultrasonic cleaning device for semi-conductor chemical mechanical grinding precision parts, which is used to replace the existing ultrasonic cleaning equipment

Method used

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  • Automatic ultrasonic cleaning device for semiconductor chemical mechanical grinding precision part
  • Automatic ultrasonic cleaning device for semiconductor chemical mechanical grinding precision part
  • Automatic ultrasonic cleaning device for semiconductor chemical mechanical grinding precision part

Examples

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Embodiment 1

[0025] This embodiment provides an automatic ultrasonic cleaning device for semi-conductor chemical mechanical grinding precision parts, including a support frame, the top of the support frame is provided with a motor transmission device, the motor transmission includes a motor and two transmission shafts, the motor can realize forward rotation and Reverse function; there are three gears on the transmission shaft a, and two gears on the transmission shaft b, such as figure 1 As shown, the driving gear on the motor is connected to the driven gear of transmission shaft a through a chain, and the other two gears of transmission shaft a and the two gears of transmission shaft b are also connected through two chains, one end of the two chains is connected to The lifting beam of the lifting device is connected, and the other ends of the two chains are connected with the gravity block. When the motor performs forward rotation and reverse rotation, the parts carrying device will be dri...

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PUM

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Abstract

The invention discloses an automatic ultrasonic cleaning device for a semiconductor chemical mechanical grinding precision part. The automatic ultrasonic cleaning device comprises a support frame, a motor transmission device is mounted at the top of the support frame, the motor transmission device is connected with a part bearing device through a lifting device, and the lifting device is connected to the upper part of the support frame. An ultrasonic cleaning tank is arranged at the lower part of the support frame; and when a grinding head part is cleaned, the part bearing device is located in the ultrasonic cleaning tank. Automatic ultrasonic cleaning of semiconductor chemical mechanical grinding precision parts can be achieved, the parts are placed in the containing groove of the part bearing device, and the whole cleaning process can be automatically completed after a starting command is executed.

Description

technical field [0001] The invention relates to the field of cleaning equipment for grinding head parts, in particular to an automatic ultrasonic cleaning device for semiconductor chemical mechanical grinding precision parts. Background technique [0002] At present, during the ultrasonic cleaning process of the internal parts of the grinding head of semiconductor chemical mechanical grinding equipment, it is necessary to manually put precision parts into the ultrasonic tank, but the ultrasonic tank is deep, and some cleaned precision parts are relatively fragile. Collisions between parts are easy to cause bruises, and multiple parts are stacked together at the same time, resulting in an unsatisfactory ultrasonic cleaning effect; at the same time, the existing ultrasonic cleaning tanks are not perfect enough, for example: it is necessary to manually use the alarm clock to Monitoring the time of ultrasonic cleaning and the effect of parts cleaning cannot be guaranteed and mon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/12B08B3/10B08B13/00
CPCB08B3/12B08B3/10B08B13/00
Inventor 张巨宇贺贤汉朱光宇王松朋张正伟李泓波
Owner 富乐德科技发展(大连)有限公司
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