Unlock instant, AI-driven research and patent intelligence for your innovation.

Plane processing system and method for ultrathin ceramic wafer

A technology of plane processing and ceramic sheet, which is applied in metal processing equipment, machine tools suitable for grinding workpiece plane, manufacturing tools, etc., to achieve the effect of low-cost plane processing and improved stability

Inactive Publication Date: 2021-11-30
JINLING INST OF TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a system and method for surface processing of ultra-thin ceramic sheets, which can quickly, efficiently, and simply and conveniently comple

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plane processing system and method for ultrathin ceramic wafer
  • Plane processing system and method for ultrathin ceramic wafer
  • Plane processing system and method for ultrathin ceramic wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Example 1: Surface processing of ultra-thin ceramic square slices with specifications of 200*200*0.5mm

[0039] (1) Take a rectangular iron plate 1 with a specification of 300*300*25mm, and engrave a transverse groove 2 with a width of 5mm, a depth of 5mm, a length of 210mm, and a net spacing of 10mm on the front of the iron plate at a distance of 50mm from the left end of the iron plate. A total of 14 parallel and equal lengths, the clear distance between the first and last transverse grooves and the upper and lower edges of the iron plate is 50mm, and a longitudinal groove 3 with a width of 10mm, a depth of 15mm, and a length of 200mm is engraved on the right end of the transverse groove. Connect with all transverse grooves, the right end of the longitudinal groove is 30mm away from the right end of the iron plate; drill a circular horizontal water outlet channel 4 with a diameter of 10mm in the middle of the right side of the iron plate, the channel is inside the iron...

Embodiment 2

[0047] Example 2: Surface processing of ultra-thin ceramic wafers with a specification of Φ250*0.4mm

[0048] (1) Take a rectangular iron plate 1 with a specification of 350*350*30mm, and engrave a transverse groove 2 with a width of 5mm, a depth of 5mm, a length of 260mm, and a clear spacing of 10mm on the front of the iron plate, at a distance of 50mm from the left end of the iron plate. 17 parallel and equal lengths, the clear distance between the first transverse groove and the upper end of the iron plate is 50mm, and the clear distance between the last transverse groove and the lower end of the iron plate is 55mm; engrave a width of 10mm and a depth of A longitudinal groove 3 with a length of 15mm and a length of 245mm, the longitudinal groove runs through all the transverse grooves, and the right end of the longitudinal groove is 30mm away from the right side of the iron plate; a circular horizontal water outlet channel 4 with a diameter of 10mm is drilled in the middle o...

Embodiment 3

[0057] Embodiment 3: Surface processing of ultra-thin ceramic strips with specifications of 150*20*0.6mm

[0058] (1) Take a rectangular iron plate 1 with a specification of 300*250*25mm, and engrave a transverse groove 2 with a width of 5mm, a depth of 5mm, a length of 210mm, and a clear distance of 10mm on the front of the iron plate, at a distance of 50mm from the left end of the iron plate. 10 parallel and equal lengths, the clear distance between the first transverse groove and the upper end of the iron plate is 50mm, and the clear distance between the last transverse groove and the lower end of the iron plate is 60mm; engrave a width of 10mm and a depth of A longitudinal groove 3 with a length of 15mm and a length of 140mm, the longitudinal groove runs through all the transverse grooves, and the right end of the longitudinal groove is 30mm away from the right side of the iron plate; a circular horizontal water outlet channel 4 with a diameter of 10mm is drilled in the mid...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Widthaaaaaaaaaa
Login to View More

Abstract

The invention provides a plane processing system and method for an ultrathin ceramic wafer, and relates to the technical field of plane processing of ceramic products. The plane processing system for the ultrathin ceramic wafer comprises a rectangular iron plate, a water supply copper pipe, a PVC transparent water hose and a water tank. The ceramic wafer is fixed according to the siphon principle, a product can be firmly attached to the rectangular iron plate, ceramic thin strips on the left side and the right side of the ceramic wafer can effectively prevent the product from sliding out in the processing process, and the stability of product plane processing is improved.

Description

technical field [0001] The invention relates to the technical field of planar processing of ceramic products, in particular to a system and method for planar processing of ultra-thin ceramic sheets. Background technique [0002] At present, ultra-thin ceramics are widely used in the fields of aerospace, energy, machinery, electronic information, and bioengineering. The existing technology generally adopts the following steps to prepare ultra-thin ceramic sheets with a specific thickness: ① Prepare raw material powder; The powder is prepared into a molded body; ③ high-temperature sintering to obtain ceramic sheets; ④ grinding to obtain ultra-thin ceramic sheets. The process of manufacturing ceramic flakes using the above method is relatively simple, but the later grinding process is time-consuming and costly. At present, the freezing method is usually used to fix the ceramic flakes first, and then surface grinding or grinding processing is performed. The processing quality of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B7/22B24B41/06B24B7/07
CPCB24B7/22B24B41/068B24B7/07
Inventor 蒋跃南邵索拉
Owner JINLING INST OF TECH