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Liquid ejecting head and liquid ejecting apparatus

A liquid ejection head, liquid technology, applied in printing devices, inking devices, printing and other directions, can solve problems such as cracks and deflections

Pending Publication Date: 2021-11-30
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a structure, if a large load is applied downward when connecting the COF substrate, deflection may occur in the wall constituting the flow channel, resulting in cracks

Method used

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  • Liquid ejecting head and liquid ejecting apparatus
  • Liquid ejecting head and liquid ejecting apparatus
  • Liquid ejecting head and liquid ejecting apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0024] Below, in reference to figure 1 At the same time, the liquid ejection device 100 according to the first embodiment will be described.

[0025] figure 1 It is an explanatory diagram showing the configuration of the liquid ejection device 100 according to the present embodiment.

[0026] The liquid ejection device 100 of the present embodiment is an inkjet type printing device that ejects liquid ink onto the medium PP. Although the medium PP is typically printing paper, any printing target such as a resin film or cloth can also be used as the medium PP.

[0027] Such as figure 1 As illustrated, the liquid ejection device 100 includes a liquid container 93 that stores ink. As the liquid container 93 , for example, a cartridge detachable from the liquid ejection device 100 , a pouch-shaped ink bag formed of a flexible film, an ink tank capable of replenishing ink, or the like can be used. In the liquid container 93, a plurality of inks of different colors are stored. ...

no. 2 approach

[0087] Hereinafter, a liquid ejection head 1A according to the second embodiment will be described.

[0088] The liquid ejection head 1A of the present embodiment differs from the first embodiment in that, at the connection position to the wiring board 8 , the direction in which the wiring portions W1 and W2 extend runs in the direction of the entire pressure. The electric elements PZ1 and PZ2 are not the same, but differ according to the position in the Y-axis direction. About the structure other than that, it is the same as that of 1st Embodiment. Therefore, about the same configuration as that of the first embodiment, the same reference numerals as those of the first embodiment will be assigned, and detailed description will be omitted.

[0089] Figure 8 It is a plan view when the structure around the wiring board 8 of the liquid ejection head 1A according to the second embodiment is viewed from the Z-axis direction, and the wiring board 8 is shown by a dotted line, and ...

no. 3 approach

[0094] Hereinafter, a liquid ejection head 1B according to the third embodiment will be described.

[0095] In the first embodiment and the second embodiment described above, the embodiment in which the two piezoelectric elements PZ1 and PZ2 are provided corresponding to one nozzle N is illustrated, but the present invention is not limited to such an embodiment. For example, in the liquid ejection head 1B of this embodiment, one piezoelectric element is provided corresponding to one nozzle.

[0096] Figure 9 is an exploded perspective view of the liquid ejection head 1B according to this embodiment.

[0097] Such as Figure 9 As shown, the liquid ejection head 1B according to this embodiment includes a nozzle substrate 60B instead of the nozzle substrate 60 , a communication plate 2B instead of the communication plate 2 , a pressure chamber substrate 3B instead of the pressure chamber substrate 3 , and a vibration chamber instead of the vibration chamber substrate 3B. The ...

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Abstract

The invention provides a liquid ejecting head and a liquid ejecting apparatus capable of suppressing generation of cracks in a wall surface of a nozzle flow path caused by a load when connecting a wiring substrate. The liquid ejecting head includes: a pressure chamber; a piezoelectric element that generates energy for applying pressure to an ink in the pressure chamber; a nozzle channel that extends in the X-axis direction and communicates with a nozzle for ejecting the ink; a supply communication channel which enables the pressure chamber and the nozzle channel to communicate with each other; a discharge communication channel which communicates with the nozzle channel; a wiring substrate electrically coupled to a drive circuit that drives the piezoelectric element; and a wiring section that electrically couples the wiring substrate and the piezoelectric element, in which, as viewed in the Z-axis direction orthogonal to the X-axis direction, the wiring section is provided at a position at which the wiring section overlaps the nozzle channel, and the wiring section extends in the + / -Q direction, which differs from the X-axis direction.

Description

technical field [0001] The present invention relates to a liquid ejection head and a liquid ejection device. Background technique [0002] Conventionally, there is known a liquid ejection head in which a pressure is applied to a pressure chamber by driving a piezoelectric element or the like to eject liquid in the pressure chamber from a nozzle. Patent Document 1 describes a head in which a plurality of piezoelectric elements are arranged in two columns and a COF (Chip On Film: Chip On Film) for supplying drive signals to the piezoelectric elements is described. ) substrates are arranged between columns. In this head, a plurality of lead electrodes for connecting the COF substrate are formed, and each lead electrode extends in a direction from one column toward another. [0003] However, in a head having a structure in which a liquid is circulated inside, a flow path for sending out a liquid may be formed below the position where the COF substrate is connected along the di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/01B41J29/393
CPCB41J2/01B41J29/393B41J2202/12B41J2/14233B41J2002/14419B41J2002/14491B41J2002/14362B41J2002/14411B41J2/04581B41J2/14201
Inventor 玉井捷太郎长沼阳一福泽祐马鹰合仁司平井荣树
Owner SEIKO EPSON CORP