Wafer transfer mechanical arm, transfer method and wafer clamp

Abstract

The invention discloses a wafer transfer mechanical arm which comprises a wafer clamp and a mechanical arm body, wherein the wafer clamp comprises a limiting device and at least one supporting claw disc, the supporting claw disc is provided with at least two supporting claw blocks, the limiting device comprises a push rod and a driving mechanism, and the driving mechanism is used for driving the push rod to horizontally move towards a containing space, and therefore, the edge of the wafer in the containing space is clamped between the push rod and the supporting claw block. and the wafer clamp is arranged on the mechanical arm body, and the mechanical arm body is used for driving the wafer clamp to translate and / or rotate. By arranging the limiting device, the wafer in the containing space is clamped and limited between the push rod and the supporting claw block, so that the phenomenon that the wafer shakes in the containing space and even is separated from the containing space due to inertia in the process that the wafer clamp drives the wafer to move is avoided, the wafer transfer safety is improved, and the wafer transfer speed can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer transfer robot arm, a transfer method and a wafer clamp. Background technique [0002] In the current semiconductor industry, on the one hand, the fixture for carrying and fixing the wafer in the horizontal state generally includes a claw plate, and a plurality of claw blocks are arranged on the claw plate, and the wafer is supported by a plurality of claw blocks, but in order to Cooperating with the original carrier of the wafer, the height of the claw block is generally set very low, slightly larger than the thickness of the wafer to form a groove that can accommodate the wafer. At the same time, in order to make the wafer fall into the groove smoothly, the groove The diameter of the wafer needs to be slightly larger than the diameter of the wafer, so that during the movement of the wafer fixture, the wafer in it is easy to slide out of the groove due to inertia,...

AI Technical Summary

Problems solved by technology

When transporting wafers, if the same pallet is used to pick and place wafers, the dirty chips will contaminate the claws on the pallet, which will cause the pallet to be cleaned when it is transported. When filming, the clean film will be polluted due to contact with the claw, which is not conducive to the subsequent process

Images