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Anode layer surface planarization processing method, OLED device and display device

A technology of surface planarization and treatment method, which is applied in the manufacture of electrical solid devices, semiconductor devices, semiconductor/solid device, etc., and can solve problems such as bumps on the surface of the anode layer and abnormal circuits.

Pending Publication Date: 2021-12-03
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The application provides a method for flattening the surface of the anode layer, an OLED device and a display device, which can solve the problem of protrusions on the surface of the anode layer and avoid circuit abnormalities caused by film rupture when preparing a thinner layer structure on the anode layer

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  • Anode layer surface planarization processing method, OLED device and display device
  • Anode layer surface planarization processing method, OLED device and display device
  • Anode layer surface planarization processing method, OLED device and display device

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0042] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " The orientation or positional relationship indicated by "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation shown in the drawings Or positional relationship is only for the convenience of describing the present i...

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Abstract

The invention provides an anode layer surface planarization processing method, an OLED device and a display device. The anode layer surface planarization processing method comprises the following steps: preparing an anode layer on a substrate; determining a to-be-flattened area of the anode layer; and thinning the thickness of the anode layer in the to-be-flattened area. After the preparation of the anode layer is completed, the to-be-flattened area is determined, and the thickness of the anode layer in the area is reduced, so that organic matters remaining on the surface of the anode layer corresponding to the opening in the preparation process of the anode layer can be removed along with thinning, no protrusion exists on one face of the thinned anode layer in the subsequent preparation process, and it is avoided that when a thin layer structure is prepared, the protrusions penetrate through the layer structure to cause film rupture, and circuit connection is abnormal.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a method for flattening the surface of an anode layer, an OLED device and a display device. Background technique [0002] In the existing field of display technology, it is a relatively common technical means to directly prepare a thinner layer structure on the anode layer to realize circuit connection. However, when preparing some thinner layer structures, it is required that the surface of the anode layer Very flat and smooth, which would otherwise impose thickness constraints on the layer structure prepared on the anode. [0003] However, during the preparation process of the anode layer, there will be organic matter covering the surface of the anode layer. After the preparation of the anode layer, organic matter will remain on the surface of the anode layer, which will make the surface of the anode layer protrude, which is easy to cause when preparing a thinner lay...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/81H10K50/8426H10K71/00
Inventor 徐乾坤
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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