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Thermal bridge for electrical components

A thermal bridge and component technology, applied in electrical components, electrical equipment structural parts, electrical solid devices, etc., can solve problems such as loss of efficiency and thermal coupling at difficult interfaces

Pending Publication Date: 2021-12-03
ティーイーコネクティビティサービシーズゲーエムベーハー
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Part loses efficiency at each thermal interface
In addition, efficient thermal coupling at the interface is difficult to achieve due to the limited thermal interface area of ​​the surface and variations, for example, due to the surface flatness of the interface surface

Method used

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  • Thermal bridge for electrical components
  • Thermal bridge for electrical components
  • Thermal bridge for electrical components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] figure 1 is a front perspective view of a communication system 100 and a thermal bridge 200 for dissipating heat from at least one electrical component 102 of the communication system 100 in accordance with an exemplary embodiment. The thermal bridge 200 is configured to be thermally coupled to the electrical component 102 at the lower thermal interface 104 at the bottom of the thermal bridge 200 . In the exemplary embodiment, heat transfer device 106 is provided to dissipate heat from thermal bridge 200 . For example, thermal bridge 200 is configured to be thermally coupled to heat transfer device 106 at upper thermal interface 108 . Thermal bridge 200 forms a thermal interface between electrical component 102 and heat transfer device 106 . The heat transfer device 106 may be a heat sink, such as a finned heat sink, configured to be air cooled by transferring heat to a passing airflow. In other various embodiments, the heat transfer device 106 may be a heat sink, a ...

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PUM

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Abstract

A thermal bridge (200) comprises an upper bridge assembly (202) comprising an upper plate (230) arranged in an upper plate stack (232) and a lower bridge assembly (204) comprising a lower plate arranged in a lower plate stack (250). The thermal bridge includes an upper spring element (212) extending from the upper plate having an upper mating interface that engages the lower plate to bias the upper plate in a first bias direction substantially away from the lower bridge assembly. The thermal bridge includes a lower spring element (214) extending from the lower plate having a lower mating interface that engages the upper plate to bias the lower plate in a second bias direction generally away from the upper bridge assembly. A bridge frame (208) having connecting elements (220) extends through the upper plate and the lower plate to hold the upper plate in the upper plate stack and the lower plate in the lower plate stack.

Description

technical field [0001] The subject of this article generally deals with the heat dissipation of electrical components. Background technique [0002] It may be necessary to transfer thermal energy (or heat) away from specified parts of a system or device. Some systems use electrical components, such as electrical connectors, to transfer data and / or power from and to different systems and devices. Some systems use electrical components, such as pluggable modules, to transmit data signals in the form of optical and / or electrical signals over communication cables. Some systems use electrical components, such as integrated circuits, to control the system. Electrical components define the source of heat generation within the system. [0003] A common challenge faced by developers of electrical systems is thermal management. Heat generated by electrical components within the system can degrade performance and even damage system components. To dissipate thermal energy, systems ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/367
CPCH05K7/20409H05K7/2039H01L23/3672H01L23/433H01L21/4882F28F9/262F28F9/001
Inventor L.J.格雷厄姆
Owner ティーイーコネクティビティサービシーズゲーエムベーハー