FAC automatic coupling packaging equipment

Abstract

The invention provides FAC automatic coupling packaging equipment, which comprises a material disc assembly provided with a material disc and a transfer arm, and a lens being stored in the material disc; a transfer assembly, erected above the charging tray assembly; a coupling table assembly, provided with a coupling table, the coupling table being used for placing a laser, a plurality of laser chips and a coupling assembly being arranged in the laser, and the coupling assembly being arranged above the coupling table assembly; a dispensing and curing assembly, provided with a glue barrel and a curing lamp; a power-on assembly, wherein the power-on assembly is provided with a probe; and a detection assembly, provided with a detection camera and a periscope. According to the equipment, feeding of the lens and posture conversion in the feeding process can be achieved, the lens coupling efficiency is high, the coupling precision is stable, the production efficiency can be effectively improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to an FAC automatic coupling packaging device. Background technique [0002] Semiconductor lasers have many advantages such as small size, light weight, high efficiency, long life, etc., which play an increasingly important role in all aspects of the national economy; with the development of practical projects, the output power requirements for semiconductor lasers are getting higher and higher. Higher, in order to obtain high output power, it is necessary to use an array semiconductor laser, that is, multiple semiconductor lasers are linearly integrated on the same carrier, and the laser light generated by each semiconductor laser is gathered together through optical elements; the fast axis collimator (FAC ) is one of the most important lenses in a high-power semiconductor laser system. As the first optical element of a laser chip, if the beam is not well focused, slig...

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a FAC automatic coupling packaging equipment, its purpose is to solve the existing FAC coupling process, the experience dependence of manual coupling personnel is large, and the coupling result is unstable , Personnel have safety risks, and some FAC coupling equipment feeding and coupling require complex structures and procedures that affect production costs and efficiency

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