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Electric spark corrosion method for removing conductive material of printed circuit

A technology of conductive materials and printed circuits, which is applied in the field of electric spark corrosion for the removal of conductive materials of printed circuits, and can solve problems such as interruptions in the etching process

Active Publication Date: 2021-12-31
深圳市格安电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the existing technology, when the conductive material of the printed circuit board is etched by the electric spark method, the fine impurities generated by the etching are partly mixed in the liquid medium, and partly adhered to the surface of the circuit board, and the impurities need to be removed after the circuit board is taken out. problem, and in the process of electric spark etching, because the assembly process needs to replace the electrode head, the problem of intermittent etching will occur. The present invention proposes a method of electric spark corrosion for the removal of printed circuit conductive materials.

Method used

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  • Electric spark corrosion method for removing conductive material of printed circuit
  • Electric spark corrosion method for removing conductive material of printed circuit
  • Electric spark corrosion method for removing conductive material of printed circuit

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Embodiment Construction

[0087] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0088] An electric spark corrosion method for removing conductive materials of a printed circuit, the steps of which are:

[0089] (1) Preparatory stage;

[0090] S1: The etching platform 100 includes a liquid medium storage case 110, an X-axis displacement mechanism 120, a filter box 130, and a suction mechanism 140. A support plate 111 is horizontally arranged in the liquid medium storage case 110, and a clamp is arranged on the support plate 111. The holding part is used to place the printed circuit board on the upper end surface of the supporting plate 111 through the holding part;

[0091] S2: The water pump 141 in the suction mechanism 140...

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Abstract

The invention discloses an electric spark corrosion method for removing a conductive material of a printed circuit, belongs to the field of circuit boards, and solves the problems that in the prior art, when the conductive material of a printed circuit board is etched in an electric spark manner, generated impurities are partially mixed in a liquid medium and partially attached to the surface of the circuit board, the impurities need to be removed after the circuit boards are taken out, and etching is interrupted when an electrode tip needs to be replaced in the assembling process in the etching process. When a liquid medium is discharged, the liquid medium is dragged to perform one-way surging, on one hand, impurities mixed with the liquid medium are dragged to surge away from the circuit board and discharged along with the liquid medium, and on the other hand, the impurities attached to the surface of the printed circuit board are slightly brushed to be separated from the surface of the circuit board and discharged along with the liquid medium. Through cooperation of two etching mechanisms, electrode tip replacement is achieved, and the etching process is uninterrupted.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to the field of removing conductive materials of printed circuit boards, in particular to an electric spark corrosion method for removing conductive materials of printed circuits. Background technique [0002] When printed circuit boards are mass-produced, the chemical liquid corrosion method is the main method. The chemical liquid corrosion method is suitable for the production of large-scale circuit boards. However, before the design and production of circuit boards, a sample needs to be made in the laboratory for various performance tests. At this time, if you choose the chemical solution corrosion method suitable for mass production of circuit boards, you need to configure the chemical solution in advance, and then make the circuit board sample, which takes a long time. After the circuit board sample is produced, the chemical solution The liquid needs to be dumped and destroyed, wh...

Claims

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Application Information

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IPC IPC(8): B23H3/00B23H11/00B23H3/10
CPCB23H3/00B23H11/00B23H3/10
Inventor 夏姣芳
Owner 深圳市格安电子有限公司
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