Fan and electronic equipment
A fan and air intake technology, applied in mechanical equipment, electrical digital data processing, instruments, etc., can solve problems such as electronic devices stop working, cannot be dissipated in time, and the fan has poor heat dissipation capacity.
Active Publication Date: 2022-01-25
HONOR DEVICE CO LTD
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Problems solved by technology
[0002] Electronic devices such as the processor inside the current electronic equipment will generate heat during operation. If the heat emitted by the electronic device cannot be dissipated in time, it will cause the electronic device to stop working, and in severe cases, the processor may be burned.
In order to solve the above-mentioned problems, the existing industry installs fans in the electronic equipment, and uses the fans to dissipate the heat of the processor and other components. However, the current cooling capacity of the fans is relatively poor.
Method used
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Embodiment Construction
[0049] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.
[0050] see figure 1 and figure 2 , figure 1 is a schematic structural view of the electronic device provided in the embodiment of the present application in a state, figure 2 yes figure 1 The schematic diagram of the structure of the electronic device shown in the opened state. The embodiment of the present application provides an electronic device 1000, which is an electronic product such as a game console, a notebook computer, a personal digital assistant, a learning machine, and a tablet computer. In this embodiment, the electronic device 1000 is described as a notebook computer.
[0051] Wherein, for the convenience of description, the length direction of the electronic device 1000 is defined as the X-axis direction, the width direction of the electronic device 1000 is the Y-axis direction, the thickness direction of the e...
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The invention provides a fan and electronic equipment. The fan comprises a body, and an air duct, an air outlet and a drainage inlet are formed in the body; the air duct comprises an air inlet area and an air outlet area, and a drainage piece is arranged in the air outlet area; the drainage piece comprises a first guide plate, a second guide plate and a sleeve; the drainage piece and the body form a first channel, a second channel and a third channel; the sleeve comprises a drainage cavity; one side of the second channel is isolated from the air inlet area, a drainage outlet is formed in the other side of the second channel, and the drainage outlet and the air outlet face the same direction and are communicated; the air inlet area, the first channel and the air outlet are sequentially communicated, and the air inlet area, the third channel and the air outlet are sequentially communicated; and the drainage inlet, the drainage cavity and the second channel are sequentially communicated. After main airflow in the air inlet area enters the first channel and the third channel, a negative pressure area is formed at the drainage outlet, pressure difference exists between the negative pressure area and air pressure in the second channel, the pressure difference enables air to enter the drainage cavity from the drainage inlet to form induced airflow, and the air outlet amount is increased.
Description
technical field [0001] The present application relates to the technical field of heat dissipation of electronic products, in particular to a fan and electronic equipment. Background technique [0002] Electronic devices such as processors inside current electronic equipment will generate heat during operation. If the heat emitted by the electronic devices cannot be dissipated in time, the electronic devices will stop working, and in severe cases, the processor may be burned. In order to solve the above-mentioned problems, existing manufacturers install fans in the electronic equipment to dissipate heat from devices such as processors. However, the current fans have poor heat dissipation capabilities. Contents of the invention [0003] The present application provides a fan and electronic equipment to improve heat dissipation and prevent overheating of processors and other electronic components. [0004] The fan of the present application includes: a body, the body include...
Claims
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IPC IPC(8): G06F1/20G06F1/16F04D29/66F04D29/44
CPCG06F1/20G06F1/1633G06F1/1616F04D29/441F04D29/667F04D29/602F04D29/4226F05D2250/14G06F1/203F04D17/16F04D29/4213F04D29/624
Inventor 杨涛赵勇高漫霍国亮
Owner HONOR DEVICE CO LTD