BIM technology-based thermal insulation board laying method
A technology of thermal insulation boards and laying methods, which is applied in metal processing and other directions, can solve problems such as unfavorable boards for subsequent use, inability to clamp boards, and affect the efficiency of board laying, so as to improve installation efficiency and assembly accuracy, reduce manual operation intensity, and benefit The effect of subsequent assembly
Pending Publication Date: 2022-02-08
郭肖肖
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Problems solved by technology
[0005] The present invention can solve the problem that when laying the existing thermal insulation boards, it is usually necessary to manually measure one by one, and then cut the boards according to the requirements, resulting in poor laying effect of the boards, low assembly accuracy, and affecting the laying efficiency of the boards. When the equipment is cutting the insulation board, the cutting effect is poor, and it is usually not able to clamp the board effectively, resulting in the phenomenon that the board is easy to shake when cutting the board. At the same time, when the board is clamped, it is easy to affect the cutting effect of the board. , which is not conducive to the subsequent use of the board and other problems
Method used
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[0041] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0042] Such as Figure 1 to Figure 9 As shown, a method for laying insulation boards based on BIM technology, the method for laying insulation boards based on BIM technology adopts the following processing equipment, the processing equipment includes a floor frame 1, a conveying device 2 and a cutting device 3, and the floor frame 1 It has a rectangular structure, a conveying device 2 is installed on the left side of the upper end of the bottom frame 1, and a cutting device 3 is installed on the right side of the upper end of the bottom frame 1.
[0043] The conveying device 2 includes a support frame 21, a storage frame 22, a moving mechanism 23, a transport frame 24 and a clamping mechanism 25, and the left side of the upper end of the bottom fram...
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The invention relates to a BIM technology-based thermal insulation board laying method. A bottom plate frame, a conveying device and a cutting device are arranged. The bottom plate frame is of a rectangular structure, the conveying device is mounted on the left side of the upper end of the bottom plate frame, and the cutting device is mounted on the right side of the upper end of the bottom plate frame. The method can solve the problems that when existing thermal insulation boards are laid and processed, manual measurement is generally needed one by one, then the boards are cut according to needs, the laying effect of the boards is poor, the assembly precision is low, and the laying efficiency of the boards is affected, and when existing equipment cuts the thermal insulation boards, the cutting effect is poor, a board cannot be effectively clamped generally, so that the board is prone to shaking during cutting, meanwhile, when the board is clamped, cutting of the board is prone to being affected, and follow-up use of the board is not facilitated.
Description
technical field [0001] The invention relates to the technical field of building BIM, in particular to a method for laying thermal insulation boards based on BIM technology. Background technique [0002] BIM technology mainly establishes a virtual three-dimensional model of construction engineering, and uses digital technology to provide a complete construction engineering information library consistent with the actual situation for this model. The application of BIM technology in construction engineering has effectively improved the efficiency of construction, saved resources and reduced costs. [0003] At present, the following defects usually exist in the laying process of the existing thermal insulation boards: 1. When laying the existing thermal insulation boards, it is usually necessary to manually measure one by one, and then cut the boards according to the requirements, resulting in the laying of the boards. Poor effect and low assembly precision affect the laying ef...
Claims
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IPC IPC(8): B26D1/08B26D7/01B26D7/06B26D7/20B26D7/27
CPCB26D1/08B26D7/01B26D7/0625B26D7/20B26D7/27
Inventor 郭肖肖
Owner 郭肖肖