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Processing device

A processing device and processing condition technology, applied in the direction of storage devices, grinding devices, metal processing equipment, etc., can solve the problems of uneven wafer thickness, low productivity, and inability to start wafer processing, etc., and achieve the effect of shortening time and cutting time

Pending Publication Date: 2022-03-01
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the processing of the wafers accommodated in the cassette placed on the second cassette stage cannot be started until the setting of the processing conditions is changed.
Therefore, when the last wafer stored in the cassette on the first cassette stage is ground and transported from the chuck table to the cassette, and the first wafer in the cassette on the second cassette stage is transferred to the card The time of the disc table makes the grinding tool stand by, so the productivity is low
In addition, when the temperature in the processing chamber drops while the grinding wheel is on standby, the thickness of the wafer becomes uneven.

Method used

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Embodiment Construction

[0015] 1 Structure of processing device

[0016] figure 1 The shown processing apparatus 1 is a processing apparatus that processes a wafer 17 held by any one of the three chuck tables 2 using the first processing unit 3 and the second processing unit 5 . Hereinafter, the structure of the processing apparatus 1 is demonstrated. like figure 1 As shown, the processing device 1 has a base 10 extending along the Y-axis direction. The first column 11 is erected on the +Y direction side of the base 10 and on the +X direction side, and the second column 12 is erected on the −X direction side of the first column 11 . In addition, the processing device 1 has a housing cover 100 , and various components of the processing device 1 are covered by the housing cover 100 .

[0017] The first cartridge stage 7010 is arranged on the −Y direction side of the base 10 and on the +X direction side, and the second cartridge stage 7020 is arranged on the −X direction side of the first cartridge ...

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Abstract

The invention provides a processing apparatus which continuously processes a wafer without making a processing unit standby. When the processing of all the wafers accommodated in the first cassette placed on the first cassette stage is finished, the last wafer is carried out from the holding surface of the chuck table, and the holding surface is free, the wafer accommodated in the second cassette placed on the second cassette stage is immediately carried into the holding surface through the control of the carrying control part. When the wafer held by the holding surface is switched from the wafer carried out from the first cassette to the wafer carried out from the second cassette, the processing condition corresponding to the second cassette stage is switched by the switching control of the switching unit.

Description

technical field [0001] The invention relates to processing devices. Background technique [0002] The grinding device for grinding wafers places a cassette containing wafers in a shelf shape on the cassette stage, and grinds the wafers taken out of the cassette with a grinding tool under preset processing conditions. The ground wafers are stored in a cassette. [0003] As shown in Patent Document 1, a grinding apparatus is provided with a plurality of cartridge stages such as a first cartridge stage and a second cartridge stage. Then, after grinding the wafer contained in the cassette mounted on the first cassette stage, the wafer contained in the cassette mounted on the second cassette stage was ground under the same processing conditions. [0004] In recent years, in order to produce a small amount of wafers of various types, wafers in a cassette placed on the first cassette stage and wafers in a cassette mounted on the second cassette stage are sometimes ground using a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22B24B27/00B24B41/06B24B41/00
CPCB24B7/228B24B27/0076B24B27/0092B24B41/068B24B41/00H01L21/67219H01L21/67745H01L21/67276B24B37/345B24B41/06H01L21/67778H01L21/67748B65G2201/0297B65G1/0485H01L21/68771
Inventor 木川有希子福士畅之
Owner DISCO CORP