Evaporation cavity enhanced boiling surface structure and thermosyphon radiator

A technology of enhanced boiling and surface structure, applied in the direction of indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of small application range of radiators and difficulty in meeting the requirements of enhanced boiling of different phase change working fluids

Pending Publication Date: 2022-03-11
GUANGDONG ENVICOOL TECH CO LTD
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Problems solved by technology

However, for different heat dissipation conditions, the inside of the thermosyphon radiator will be filled with different phase-change working fluids, and different phase-change working fluids have different requirements for strengthening the surface due to their different physical parameters. The enhanced surface structure is difficult to meet the enhanced boiling requirements of different phase change working fluids
At the same time, when the radiator wor

Method used

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  • Evaporation cavity enhanced boiling surface structure and thermosyphon radiator
  • Evaporation cavity enhanced boiling surface structure and thermosyphon radiator
  • Evaporation cavity enhanced boiling surface structure and thermosyphon radiator

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] Please refer to Figure 1 to Figure 5 , figure 1 It is a schematic diagram of the overall structure of the thermosiphon radiator in a specific embodiment of the present invention; figure 2 It is a structural exploded view of a thermosiphon radiator in a specific embodiment of the present invention; image 3 It is a schematic diagram of the internal structure of the evaporation chamber in a specific embodiment of the present invention; Figure 4 It i...

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Abstract

The invention discloses an evaporation cavity enhanced boiling surface structure and a thermosyphon radiator, and belongs to the technical field of radiators, the evaporation cavity enhanced boiling surface structure comprises a plurality of micro-channel structures which are located on the surface of an evaporation cavity and are different in size, and the micro-channel structures are arranged to form an enhanced boiling surface, and the micro-channel structures with the same size are uniformly distributed on the surface of the evaporation cavity. A plurality of micro-channel structures with different sizes are designed on the surface of the evaporation cavity, so that when different types of phase-change working media are filled in the thermosiphon radiator, the optimal nucleation sizes of different phase-change working media can be considered, and the same phase-change working media can be ensured to have the optimal nucleation size under different working conditions; therefore, the radiator can achieve the best enhanced boiling heat exchange effect under various working conditions, and the application range of the thermosyphon radiator is widened.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to an enhanced boiling surface structure of an evaporation chamber and a thermosiphon radiator. Background technique [0002] Thermosyphon radiators are radiators that use the principle of phase-change heat to dissipate heat. They mainly use the latent heat of phase-change working fluids and gas-liquid circulation to improve heat dissipation capabilities. They are mainly used in the field of electronic heat dissipation. At present, the design of thermosyphon radiators is still in its infancy, and the existing design fails to give full play to the best performance of thermosyphon radiators. The reason is that the boiling and condensation process at the core of thermosiphon radiators is not fully understood. In the process of phase change heat, there is still a large phase change thermal resistance. In the prior art, a reinforced surface is designed on the surface of the evaporatio...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 王烨张晶丁耿林陈乔龙
Owner GUANGDONG ENVICOOL TECH CO LTD
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