Chip continuous welding self-detection method and system, medium and chip

Abstract

The invention provides a chip continuous welding self-detection method and system, a medium and a chip. The method comprises the following steps: setting the controllable port to be in an input state; configuring the controllable port meeting the to-be-configured condition, so that the controllable port meeting the to-be-configured condition is pulled up to a high level or pulled down to a low level; reading a first level value of the controllable port; judging whether continuous welding occurs on the controllable port based on the first level value; according to the invention, by writing a chip continuous welding self-detection algorithm on the chip, the purpose of detecting whether a circuit between chip ports is subjected to continuous welding short circuit or not is achieved, product defects can be found in early production, the method is a beneficial supplement for existing ICT, FCT and other detection, and the production efficiency, the detectability and the product quality of products are improved.

Description

technical field [0001] The invention belongs to the technical field of chip detection, and in particular relates to a method, system, medium and chip for self-testing of chip continuous welding. Background technique [0002] Existing chip testing usually includes two testing technologies: ICT (In-Circuit Test, circuit test) and FCT (Function Test, functional test); among them, ICT is a relatively simple simulation, mainly used to check component failures and soldering If there is a fault, it will be carried out in the next process of board welding, and the board with problems (such as device reverse welding, short circuit, etc.) will be repaired directly on the welding line; FCT is an electronic and electrical functional test, that is, after completing the ICT test steps, go to The power-on state of the product is used to test the parameters of the product during normal operation; the existing chips have achieved better detection results with the help of these two detection ...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a self-detection method, system, medium and chip for chip soldering, which is used to solve the problem that the existing chip detection technology cannot detect whether there is a soldering short circuit between the chip ports. question of purpose

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