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Solid state disk

A solid-state hard drive and circuit board technology, applied in the field of hard drives, can solve the problems of poor heat dissipation of memory particles and achieve a wide range of applications

Active Publication Date: 2022-04-05
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of the poor heat dissipation effect of the memory particles of the inner circuit board in the prior art, thereby providing a solid state hard disk that enhances the heat dissipation effect of the memory particles of the memory circuit board

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Embodiment Construction

[0024] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention relates to the technical field of hard disks, in particular to a solid state disk. The solid state disk comprises a shell, a first circuit board, a second circuit board, a first temperature conducting plate and a second temperature conducting plate, the first circuit board is arranged in the shell and connected to the top of the shell, and a plurality of first memory particles are arranged on the lower surface of the first circuit board; the second circuit board is arranged in the shell and connected to the bottom of the shell, and a plurality of second memory particles are arranged on the upper surface of the second circuit board; the first circuit board and the second circuit board are arranged at an interval, and the interval between the first circuit board and the second circuit board is a heat dissipation channel suitable for heat dissipation airflow to pass through; the first heat conduction plate is connected to the first circuit board, abuts against the first memory particles and is located in the heat dissipation channel; the second heat conduction plate is connected to the second circuit board, abuts against the second memory particles and is located in the heat dissipation channel.

Description

technical field [0001] The invention relates to the technical field of hard disks, in particular to a solid state hard disk. Background technique [0002] With the development of science and technology, today's storage media has been fully upgraded from mechanical hard drives to solid state drives. Solid state drives, referred to as solid disks or SSDs (Solid State Drives), refer to hard drives made of solid-state electronic memory chip arrays. [0003] With the development of solid-state drives, the performance of FPGA, the main component of solid-state drives, is rapidly improving, and the capacity density of solid-state drives is also greatly increasing. Similarly, the number of memory particles (Flash) attached to a standard 2.5-inch solid state drive is increasing, and the circuit board (PCB) is also changed from a single layer to a double layer. The heat dissipation design of the solid-state hard disk mainly depends on the auxiliary heat dissipation of the shell. Whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B33/14
CPCY02D10/00
Inventor 颜俐君
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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