Substrate design method for preventing bottom filling glue from overflowing
A technology of underfill and design method, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems affecting product performance and production, diffusion, substrate pollution, etc., to avoid pollution and improve reliability. , to avoid the effect of overflow
Active Publication Date: 2022-04-26
GUANGDONG CHIPPACKING TECH
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Problems solved by technology
However, because the end face of the glue is located between the bottom of the chip and the substrate and is in a vertical state, even if there is tension, it will spread when the glue is injected excessively, overflowing to the outside of the chip, polluting other functional areas of the substrate, and affecting Product performance and production
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[0030] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments, so that those skilled in the art can implement it with reference to the description.
[0031] It should be understood that terms such as "having", "comprising" and "including" used herein do not exclude the presence or addition of one or more other elements or combinations thereof.
[0032] Such as Figure 1-Figure 10 As shown, the present invention provides a substrate design method for preventing underfill glue overflow, including: setting a barrier wall 1 on the substrate, the barrier wall 1 is located outside the chip, and the barrier wall 1 and the chip A glue injection area is reserved. The retaining wall 1 is a closed ring. The height of the retaining wall 1 is lower than the top of the bumped chip and higher than the bottom of the bumped chip.
[0033] The working principle and beneficial effects of the above technical solution: In or...
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The invention discloses a substrate design method for preventing bottom filling glue from overflowing, which comprises the following steps: a retaining wall is arranged on a substrate, the retaining wall is positioned outside a chip, and a glue injection area is reserved between the retaining wall and the chip. In order to prevent the bottom filling glue from overflowing, the retaining wall is arranged on the substrate, the retaining wall adopts a fixed design, the chip is welded in the annular closed retaining wall during bumping, and then glue injection is carried out by a glue gun through a glue injection area between the retaining wall and the chip, so that the chip is prevented from overflowing. Under the action of a capillary phenomenon, the glue solution can fill a bump area below the chip and diffuse outwards, then the glue solution is intercepted by the retaining wall, as the retaining wall is located between the top and the bottom of the chip, the overflowing glue solution can be shielded by the retaining wall, the end face of the glue solution is changed into a horizontal plane through the retaining wall, the glue solution can be effectively prevented from overflowing under the action of tension, and the stability of the chip is improved. Therefore, the glue solution is prevented from diffusing to other functional areas to cause pollution, the production control of the process is facilitated, and meanwhile, the reliability of the product can be improved.
Description
technical field [0001] The invention relates to the technical field of chip packaging, and more specifically, the invention relates to a substrate design method for preventing underfill glue from overflowing. Background technique [0002] In the packaging production process of Flip chip wafer, in order to solve the stress concentration of FCCSP / FCBGA, protect the reliability of chip drop and thermal shock, and prevent the problem of chip moisture and other forms of pollution. After the flip-chip is mounted, the process of underfilling glue will be used, that is, after filling glue at one end of the chip, the glue will automatically fill to the bottom of the FC due to capillary phenomenon (such as figure 1 shown), so that the bumps of the FC are filled with underfill glue. However, because the end face of the glue is located between the bottom of the chip and the substrate and is in a vertical state, even if there is tension, it will spread when the glue is injected excessiv...
Claims
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Login to View More IPC IPC(8): H01L23/24H01L21/54
CPCH01L23/24H01L21/54
Inventor 陈勇饶锡林梁大钟张怡程浪蔡择贤
Owner GUANGDONG CHIPPACKING TECH