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Waterproof method of electronic equipment and electronic equipment

A technology for electronic equipment and areas, applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, sealed shell, etc., can solve the problem of poor waterproof performance of mobile terminals, ensure the strength, improve the reliability of the whole machine, and ensure the back glue The effect of width requirements

Pending Publication Date: 2022-05-10
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of this application is to provide a waterproof method for electronic equipment and electronic equipment to solve the technical problem of poor waterproof performance of mobile terminals in the related art

Method used

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  • Waterproof method of electronic equipment and electronic equipment
  • Waterproof method of electronic equipment and electronic equipment
  • Waterproof method of electronic equipment and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0058] Example 1, such as image 3 as shown, image 3 It shows a partial cross-sectional view of the bonded state of the middle frame 20 and the screen module 30. The left side of the figure is the central area close to the middle frame, and the right side is the edge area of ​​the middle frame. image 3 Among them, the back glue 212, the solid hot melt glue 211 and the dispensing body 213 are arranged from left to right (that is, the center of the middle frame is arranged in sequence toward the edge of the middle frame).

example 2

[0059] Example 2, combined with Example 1, the adhesive can be pasted on the left side of the solid hot melt adhesive, and the dispensing body can be fixed on the right side of the solid hot melt adhesive.

[0060] The method for waterproofing electronic equipment provided by the embodiment of the present application can fix the solid hot melt adhesive on the first surface of the middle frame; then attach the display module to the middle frame; and then heat the solid hot melt adhesive so that the solid heat The adhesive melts and in the process seals the area between the adhesive backed area and the dispensed area. Among them, the adhesive area is pasted with adhesive, and the dispensing area is filled with a little glue; the dispensing area is set around the adhesive area on the middle frame. Therefore, this waterproof method does not need to open glue holes on the middle frame, which ensures the structural strength of the middle frame and improves the reliability of the ele...

example 3

[0073] Example 3, combined with Example 2, refer to image 3 , the left side of the back glue 212 is pasted on the middle frame, and the right side is pasted with the first area of ​​solid hot melt adhesive.

[0074] In this way, by partially covering the back glue on the first area of ​​the solid hot melt adhesive, the partial overlap of the back glue and the solid hot melt adhesive can better fix the solid hot melt adhesive on the middle frame, and in the solid heat After the melt glue is melted, there is an overlapping area between the solid hot melt glue and the back glue, which improves the waterproof performance.

[0075] Optionally, in this embodiment of the present application, after step 101 and before step 102, step 105 is also included.

[0076] Step 105, performing glue dispensing on the glue dispensing area of ​​the middle frame.

[0077] Exemplarily, a glue dispensing body may be used to directly perform glue dispensing on the above glue dispensing area.

[00...

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Abstract

The invention discloses a waterproof method of electronic equipment and the electronic equipment, and the waterproof method of the electronic equipment comprises the steps: fixing a solid hot melt adhesive on a first surface of a middle frame; the display module is attached to the middle frame; heating the solid hot melt adhesive to melt the solid hot melt adhesive, and sealing an area between the back adhesive area and the adhesive dispensing area in the melting process; wherein back glue is adhered to the back glue area, and the dispensing area is filled with a dispensing body; the glue dispensing area is arranged on the middle frame around the back glue area.

Description

technical field [0001] The application belongs to the technical field of communications, and in particular relates to a waterproof method for electronic equipment and the electronic equipment. Background technique [0002] With the popularization of mobile terminals, there are more and more mobile terminal users, and correspondingly, users have higher and higher requirements for waterproofing of mobile terminals. [0003] The waterproof solution of the related technology usually opens a glue hole on the middle frame of the mobile terminal, and then attaches the screen cover of the mobile terminal to the middle frame by dispensing glue and back glue, and then pours it through the back of the middle frame. Glue is poured into the glue hole to seal the gap between the dot glue and the back glue, thus completing the seal between the middle frame and the screen cover. [0004] However, on the one hand, the position corresponding to the glue filling hole occupies the width of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06
CPCH05K5/064H05K5/062
Inventor 徐扬文付建辉班起周云生
Owner VIVO MOBILE COMM CO LTD
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