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Material injection equipment capable of automatically ejecting mold for manufacturing bipolar transistor

A bipolar transistor, top mold technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the inability of equipment to achieve organic combination and linkage, low efficiency, and poor quantity.

Inactive Publication Date: 2022-05-31
江苏韦达半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The method of adding liquid during use is to open a notch and then enter the high-temperature raw material flow into the fixed mold, so the efficiency is relatively low and the quantity is not easy to control;
[0004] 2. The injection equipment in the prior art is used for the manufacture of bipolar transistors and is prepared in large quantities simultaneously, so it is difficult for the top mold equipment to achieve synchronous and efficient ejection;
[0005] 3. The equipment in the prior art cannot achieve organic combination and linkage, but requires a lot of driving equipment and control equipment to realize the process of bipolar transistor manufacturing and injection, resulting in relatively high cost;

Method used

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  • Material injection equipment capable of automatically ejecting mold for manufacturing bipolar transistor
  • Material injection equipment capable of automatically ejecting mold for manufacturing bipolar transistor
  • Material injection equipment capable of automatically ejecting mold for manufacturing bipolar transistor

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Embodiment Construction

[0035]In order to make the technical solutions of the present invention clearer and clearer to those skilled in the art, the present invention will be further described in detail below in conjunction with the examples and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0036] Such as Figure 1-Figure 7 As shown, a kind of injection equipment for bipolar transistor manufacturing that can automatically push the top mold provided in this embodiment includes a U-shaped base 10, and L-shaped side frames 11 are installed at the ends of both sides of the U-shaped base 10, and The top of the L-shaped side frame 11 is equipped with a fixed support plate assembly, the bottom middle of the U-shaped base 10 is provided with a lifting screw drive assembly, and one end of the U-shaped base 10 top is equipped with a support push rod 28, and the top of the support push rod 28 The liquid distribution plate 13 is installed, the middle part of the l...

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Abstract

The invention discloses a bipolar transistor manufacturing injection device capable of automatically ejecting a mold, and belongs to the technical field of injection devices. A driving motor is started to drive a lower adjusting screw rod and an upper adjusting screw rod to rotate, so that an adjusting turntable adjusts a lower lifting connecting frame to move upwards, and an ejection plate is inserted into the ejection mold; the lower adjusting screw rotates to drive the adjusting rotary disc to move, the hinge rod is adjusted to push the push rod to move, the linkage plate is adjusted to move through the push rod, the liquid adding pipe moves to be located above the top mold, and the water pump is started to enable raw materials to be guided into the top mold through the liquid distribution plate, the liquid outlet pipe and the liquid guide hose.

Description

technical field [0001] The invention relates to a material injection device, in particular to a material injection device for manufacturing a bipolar transistor that can automatically top mold, and belongs to the technical field of material injection equipment. Background technique [0002] In the prior art, there are the following problems in the injection equipment used to manufacture bipolar transistors: [0003] 1. The method of adding liquid during use is to open a notch and then enter the high-temperature raw material flow into the fixed mold, so the efficiency is relatively low and the quantity is not easy to control; [0004] 2. The injection equipment in the prior art is used for the manufacture of bipolar transistors and is prepared in large quantities simultaneously, so it is difficult for the top mold equipment to achieve synchronous and efficient ejection; [0005] 3. The equipment in the prior art cannot achieve organic combination and linkage, but requires a ...

Claims

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Application Information

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IPC IPC(8): B29C43/18B29C43/34B29C43/50H01L21/56
CPCB29C43/18B29C43/50B29C43/34H01L21/565B29C2043/182
Inventor 程万坡
Owner 江苏韦达半导体有限公司