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Josephson junction manufacturing method

A technology of Josephson junction and dry etching, which is used in the manufacture/processing of superconductor devices, devices and instruments containing a junction of different materials, etc., which can solve the problems of shortening the life of qubits and difficult to control the critical current.

Pending Publication Date: 2022-06-07
IQM FINLAND OY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the critical current (and normal state resistance) of the "macroscopic" junction is difficult to control
Inhomogeneous tunneling and two-level systems occurring on grain boundaries also shorten qubit lifetimes

Method used

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Embodiment Construction

[0024] At the first stage of the manufacturing method, in Figure 1A and Figure 1B The final result is depicted in , forming a stack on substrate 1 . The stack includes a first electrode layer 2 , a dielectric layer 3 and a second electrode layer 4 . The first electrode layer 2 is adjacent to the substrate 1 and the lower surface 11 of the first electrode layer 2 facing the substrate 1 is also referred to as the lower surface 11 of the stack. The dielectric layer 3 is located between the first electrode layer 2 and the second electrode layer 4 . The second electrode layer 4 , which lies above the first electrode layer 2 and the dielectric layer 3 with respect to the substrate 1 , has an upper surface 12 , which is also referred to as the upper surface 12 of the stack. The first electrode layer 2 , the dielectric layer 3 and the second electrode layer 4 are substantially flat and parallel to the substrate 1 .

[0025] like Figure 1B As shown, the stack also has a first s...

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Abstract

The invention provides a Josephson junction manufacturing method. The invention relates to the fabrication of Josephson junctions. Such Josephson junctions may be suitable for use in qubits. High quality possible single crystal electrodes and dielectric layers are formed using blanket deposition; a structure of one of the plurality of Josephson junctions is then formed by using multiphoton lithography to create an opening in the resist, and then etching the electrode and the dielectric layer.

Description

technical field [0001] The present invention relates to the fabrication of Josephson junctions, which may be suitable, for example, for use in qubits. Background technique [0002] The Josephson junction is the core element of superconducting qubits, where the mass of the Josephson junction is a major factor in the lifetime of the qubit. Traditionally, Josephson junctions used in superconducting qubits are fabricated using shadow evaporation: a hollow structure is defined on the resist by photolithography, allowing aluminum films deposited from different angles to overlap each other, with the original process in the middle. in-situ oxidation process followed by stripping. Aluminum films and aluminum oxide layers formed in this way are generally polycrystalline with grain sizes of about 10 nm, which is significantly smaller than the size of the junction at about 100 nm. [0003] In fact, a "macro" Josephson knot consists of many smaller "micro" knots that are seamed togethe...

Claims

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Application Information

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IPC IPC(8): H01L39/24H01L39/12H01L39/22
CPCH10N60/85H10N60/12H10N60/0912B82Y10/00G06N10/40G06N10/00H10N60/805H10N69/00
Inventor 李天一刘伟曼朱纳·拉马钱德拉帕·文卡泰什哈斯南·艾哈迈德曾国维陈冠言
Owner IQM FINLAND OY