Chip reliability test method and device and chip equipment

Abstract

The invention relates to a chip reliability test method and device and chip equipment, and the method comprises the steps: firstly, transmitting a test sequence to a tested function logic of a chip, then obtaining a pulse signal according to a reference signal and an output value of the tested function logic, converting the change process of a time sequence into time delay change of comparing the reference signal with the output value of the tested function logic, and then transmitting the pulse signal to a delay chain of the chip to obtain a delay value of the pulse signal in the delay chain, measuring time delay change by adopting a delay link mode, and judging that the chip is reliable when the delay value of the test sequence is smaller than or equal to a preset delay threshold value. According to the method, on-chip resources of the chip are utilized, few external resources are needed, the application effect is good, a high-precision delay chain structure is adopted in the testing process, the testing result is more accurate, whether the chip is reliable or not is judged according to the accurate delay value, the method has great significance in guiding chip design and application, and the use reliability of the chip is improved.

Description

technical field [0001] The present application relates to the field of chip technology, and in particular, to a chip reliability testing method, device and chip device. Background technique [0002] Chip generally refers to semiconductor component products, including various integrated circuits and modules, which have different functions on different devices and are widely used. The chip includes a large number of configurable input and output modules, digital processors, and digital clock management units, which can be regarded as modular IP cores, which greatly reduces the cost of hardware development and becomes a flexible configuration module. [0003] However, the flexible configuration of the chip complicates its test implementation process, and problems such as insufficient test coverage occur frequently. For example, in the process of chip application, there are many different reasons that can lead to the failure of the application process, and one of the main facto...

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a chip reliability testing method, device and chip equipment for the problem of low timing reliability of traditional chips.

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