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Surface acoustic wave device, packaging module and manufacturing method of surface acoustic wave device

A technology of surface acoustic wave device and manufacturing method, which is applied in the direction of electrical components, impedance networks, etc., can solve problems such as cracking of passivation layer pads, and achieve the effect of avoiding adverse effects

Active Publication Date: 2022-07-08
RADROCK CHONGQING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: aiming at the problem that the passivation layer of the SAW device is easily broken on the side of the pad in the prior art, to provide a surface acoustic wave device, a packaging module and a manufacturing method of the surface acoustic wave device

Method used

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  • Surface acoustic wave device, packaging module and manufacturing method of surface acoustic wave device
  • Surface acoustic wave device, packaging module and manufacturing method of surface acoustic wave device
  • Surface acoustic wave device, packaging module and manufacturing method of surface acoustic wave device

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Experimental program
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Embodiment 1

[0027] like figure 2 As shown, in the first embodiment, the surface acoustic wave device 100 includes a piezoelectric substrate 1 , an IDT structure 2 , a lead 3 , a pad 4 and a passivation layer 5 . The upper surface of the piezoelectric substrate 1 has a first bearing area 11 and a second bearing area 12, the IDT structure 2 and the lead 3 are electrically connected, and both are arranged on the upper surface of the piezoelectric substrate 1, and the IDT structure 2 is located in The first carrying area 11 and the leads 3 are located in the second carrying area 12 . The pad 4 is arranged on the upper surface of the lead 3 , and the passivation layer 5 covers the outer surfaces of the IDT structure 2 , the lead 3 and the pad 4 .

[0028] In the first embodiment, the materials of the IDT structure 2 and the lead 3 are the same, and both can be made of copper-aluminum alloy. In addition, the thickness of the IDT structure 2 is 100 nm-500 nm, and the thickness of the IDT stru...

Embodiment 2

[0047] like Image 6 As shown, the difference between the second embodiment and the first embodiment is: in the second embodiment, along the bottom-up direction, the pad 4 includes at least two solder layers, and these solder layers have the first solder layer 41 and The second solder layer 42 , wherein the first solder layer 41 is arranged on the upper surface of the lead 3 , and the second solder layer 42 is arranged on the upper surface of the first solder layer 41 . Wherein, the side surface of the first solder layer 41 protrudes from the second solder layer 42 , so that a first step structure is formed between the first solder layer 41 and the second solder layer 42 ; the passivation layer 5 covers the outside of the first solder layer 41 . surface and the outer surface of the second solder layer 42 .

[0048] In this embodiment, by arranging the pads 4 in layers, the height of each soldering layer relative to the interface supporting the soldering layer can be made smal...

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Abstract

The invention relates to a surface acoustic wave device, a packaging module and a manufacturing method of the surface acoustic wave device. The surface acoustic wave device comprises a piezoelectric substrate, an IDT structure, a lead, a bonding pad and a passivation layer, the upper surface of the piezoelectric substrate is provided with a first bearing area and a second bearing area; the IDT structure is arranged in the first bearing area; the lead is arranged in the second bearing area and is electrically connected with the IDT structure; the bonding pad is arranged on the upper surface of the lead; the passivation layer comprises a first protection layer and a second protection layer, the first protection layer covers the outer surface of the IDT structure, the outer surface of the lead and the outer surface of the bonding pad, and the second protection layer is located in the second bearing area and covers the outer surface of the area, opposite to the side face of the bonding pad, of the first protection layer. According to the invention, the two protection layers are arranged around the bonding pad, so that the thickening treatment of the passivation layer around the bonding pad can be realized, and then the passivation layer is prevented from being broken on the side surface of the bonding pad.

Description

technical field [0001] The invention belongs to the field of radio frequency filtering devices, and relates to a surface acoustic wave device, a packaging module and a manufacturing method of the surface acoustic wave device. Background technique [0002] like figure 1 As shown, the surface acoustic wave device (ie the SAW device 100a) is a key device of the communication system, and the SAW device 100a mainly includes a piezoelectric substrate 1a, an interdigital transducer structure (ie the IDT structure 2a), a lead 3a, a pad 4a and Passivation layer 5a. The IDT structure 2a and the leads 3a are both disposed on the upper surface of the piezoelectric substrate 1a, and there are multiple leads 3a, and these leads 3a are respectively electrically connected to the corresponding electrodes of the IDT structure 2a. During production, the IDT structure 2a and the leads 3a can be simultaneously fabricated by etching the metal layer on the piezoelectric substrate 1a. The pad 4a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H03H3/08
CPCH03H9/02984H03H3/08
Inventor 杜波王华磊霍振选倪建兴
Owner RADROCK CHONGQING TECH CO LTD