Digital detonator batch potting packaging structure and potting method

A technology of digital detonator and packaging structure, applied in the field of digital detonator, can solve problems such as low efficiency of potting process, and achieve the effects of solving low efficiency, improving reliability, and preventing moisture damage

Pending Publication Date: 2022-07-22
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a digital detonator batch potting and packaging structure and potting method, which can simultaneously perform batch potting of multiple rows o

Method used

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  • Digital detonator batch potting packaging structure and potting method
  • Digital detonator batch potting packaging structure and potting method
  • Digital detonator batch potting packaging structure and potting method

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Embodiment Construction

[0040] The present invention is further described below. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and cannot be used to limit the protection scope of the present invention.

[0041] An embodiment of the present invention provides a method for batch potting of digital detonators, and the specific implementation process is as follows:

[0042] (1) Design and process multi-row and multi-shot digital detonators on PCB substrate 2, and directly perform patch processing on the PCB substrate to obtain as follows: figure 1 The unpotted digital detonator PCB board shown, the unpotted single shot digital detonator is as figure 2 (a) and figure 2 (b) shown.

[0043] It should be noted that each digital detonator and the substrate are pre-cut by wire cutting in advance, but not all of them are cut, so that the digital detonator can be easily removed from the substrate in the later stage.

[0044] (2) Place the ...

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Abstract

The invention discloses a digital detonator batch potting packaging structure and a potting method. The potting packaging structure comprises a PCB substrate, an upper die and a lower die. At least one row of digital detonators are processed on the PCB substrate, and at least one digital detonator is arranged in each row; the lower die is provided with a lower cavity and a PCB embedding groove; an upper cavity is formed in the upper mold; and the digital detonator is packaged in the upper cavity of the upper mold and the lower cavity of the lower mold through matching of the positioning holes and the positioning pins, so that an injection molding cavity is formed. During filling and sealing, feed liquid enters the feed port from the guide groove in the lower mold and enters the injection molding cavity, finally, the filled and sealed digital detonator PCB substrate is obtained, then the digital detonators are taken down from the PCB substrate one by one, and the filled and sealed single digital detonators are obtained. According to the invention, multiple rows and multiple digital detonators can be subjected to injection molding and potting simultaneously, the operation is simple and convenient, and the problem of low efficiency of the existing digital detonator protective sleeve injection molding and potting process is solved.

Description

technical field [0001] The invention relates to the technical field of digital detonators, in particular to a batch potting and packaging structure and a potting method for digital detonators. Background technique [0002] The digital detonator is a special electronic circuit module composed of a variety of electronic components that can meet the requirements of the detonator. By controlling the ignition time and action time of the ignition bridge wire of the digital detonator, the delayed blasting of the industrial detonator is realized. [0003] Due to external uncontrollable factors such as rain, sandstorm, and drop during actual use, the electronic components will be wet, short-circuited, damaged, etc., making it impossible to use normally. In order to improve its reliability and meet industrial use conditions, injection molding and potting are usually used to reinforce and protect its electronic modules. [0004] At present, most of the conventional injection molding p...

Claims

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Application Information

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IPC IPC(8): B29C45/14
CPCB29C45/14008B29C45/14819B29C2045/1486
Inventor 吴逸洲卢灿仇晨光邓闯
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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