Intelligent mobile phone circuit mainboard electroplating equipment and method
A technology for circuit boards and smartphones, applied in electrolysis components, electrolysis processes, cells, etc., can solve problems such as time-consuming, scraping of circuit boards by electroplating waste residues, etc., and achieve effective waste disposal effects
Inactive Publication Date: 2022-07-29
WENZHOU POLYTECHNIC
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Problems solved by technology
[0003] Electroplating solution is needed in the electroplating process. The existing electroplating solution is directly placed in the electroplating tank for multiple uses. The circuit board that needs to be electroplated is easily scratched by the electroplating waste residue in the electroplating process, and the electroplating tank will be replaced later. In the electroplating bath process, it takes a long time to process the waste residue, so it needs to be redesigned
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[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0031] see Figure 1-7 , the present invention provides a kind of technical scheme:
[0032] A smart phone circuit motherboard electroplating equipment, comprising a mounting plate 5, a vibration mechanism 4 is fixedly connected to the top of the mounting plate 5, a power mechanism 3 is fixedly connected to the front of the vibration mechanism 4, a plating mechanism 1 is fixedly connected to the top of the vibration mechanism 3, and t...
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Abstract
The invention belongs to the technical field of circuit mainboard electroplating, and particularly relates to intelligent mobile phone circuit mainboard electroplating equipment and method.The top of a mounting plate is fixedly connected with a vibration mechanism, the front face of the vibration mechanism is fixedly connected with a power mechanism, the top of the vibration mechanism is fixedly connected with an electroplating mechanism, and the two sides of the mounting plate are fixedly connected with circulating mechanisms; the electroplating mechanism comprises an electroplating tank, limiting blocks are fixedly connected to the front and back surfaces of the electroplating tank close to the bottom, sliding strips are fixedly connected to the tops of the limiting blocks, clamping blocks are fixedly connected to two sides of each sliding strip, an electroplating box is arranged in the electroplating tank, and clamping strips are fixedly connected to the front and back surfaces of the electroplating box corresponding to the sliding strips. Through the arrangement of the electroplating mechanism, electroplating liquid enters the electroplating box through the liquid inlet hole in the electroplating process, meanwhile, it can be guaranteed that an electroplating product is electroplated in the electroplating box, the electroplating box can be directly pulled out through a clamping strip and a sliding strip conveniently after electroplating in the later period, and electroplating waste residues and the electroplating product are separated.
Description
technical field [0001] The invention relates to the technical field of circuit motherboard electroplating, in particular to a device and method for electroplating a circuit motherboard of a smart phone. Background technique [0002] During electroplating, the plated metal or other insoluble material is used as the anode, the workpiece to be plated is used as the cathode, and the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a plated layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing metal cations in the coating should be used as the electroplating solution to keep the concentration of the metal cations in the coating unchanged. The purpose of electroplating is to coat a metal coating on the substrate and change the surface properties or dimensions of the substrate. Electroplating can enhance the corrosion resistance of metals (the plated metals are mostly ...
Claims
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IPC IPC(8): C25D17/00C25D21/06C25D21/00C25D17/06C25D7/00
CPCC25D17/00C25D21/06C25D21/00C25D17/06C25D7/00
Inventor 李敏涛魏鑫磊陈俊豪宋吴宇涂郁潇颖
Owner WENZHOU POLYTECHNIC