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Manufacturing method of vibration element

A technology of vibrating elements and manufacturing methods, which is applied in the direction of electrical components, material selection for piezoelectric devices or electrostrictive devices, device material selection, etc., and can solve problems such as difficulty in obtaining groove depth

Pending Publication Date: 2022-07-29
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the case of forming grooves using the microloading effect as in Patent Document 1, there is a correlation between the etched groove depth and the groove width. Therefore, when the groove width is set to a predetermined size, it may be difficult to obtain The problem of the groove depth of hope

Method used

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  • Manufacturing method of vibration element
  • Manufacturing method of vibration element
  • Manufacturing method of vibration element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0028] ***Structure of the vibration device***

[0029] figure 1 It is a cross-sectional view showing the structure of the resonator device of the present embodiment.

[0030] The vibration device 1 includes a package 3 , a vibration element 4 housed in the package 3 , a circuit element 6 , and the like. In a preferred example, the vibrating element 4 is a tuning-fork-type quartz vibrating element, and the vibrating device 1 is a quartz oscillator provided with an oscillation circuit.

[0031] like figure 1 As shown, the package 3 includes a base 31 having a concave portion 311 opened on the upper surface, and a plate-shaped cover 32 joined to the upper surface of the base 31 via a joining member 33 so as to close the opening of the concave portion 311 . Inside the package 3 , an inner space S is formed by the concave portion 311 , and the vibration element 4 and the circuit element 6 are accommodated in the inner space S.

[0032] For example, the base 31 may be made of c...

Embodiment approach 2

[0077] ***Structure of vibrating elements in different ways***

[0078] Figure 7 is a cross-sectional view of the vibrating element of this embodiment, and image 3 correspond.

[0079] In Embodiment 1, the vibrating arm 43 is configured to have one groove 432 on the front surface and one groove 433 on the back surface, but may be configured to provide a plurality of grooves. The vibrating element 5 of the present embodiment is different from the first embodiment in that two grooves 532 a and 532 b are provided on the front surface of the vibrating arm 53 and two grooves 533 a and 533 b are also provided on the back surface. The same applies to the vibrating arm 54 . Except for these points, it is the same as the vibrating element 4 of the first embodiment. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and overlapping descriptions are omitted.

[0080] like Figure 7 As shown, in the vibrating element 5 of ...

Embodiment approach 3

[0102] ***Application example***

[0103] Figure 9 is a plan view of the vibrating element of this embodiment, and figure 2 correspond.

[0104] In Embodiment 1, the case where grooves are provided in the vibrating arms 43 and 44 of the tuning-fork type vibrating element has been described, but the structures and manufacturing methods of the above-described embodiments can also be applied to those having parts corresponding to the vibrating arms. device. Hereinafter, the same reference numerals are assigned to the same components as those in the first embodiment, and the overlapping description will be omitted.

[0105] The vibration element 84 of the present embodiment is an angular velocity sensor element capable of detecting an angular velocity ωz with the Z-axis as a detection axis as a physical quantity sensor element.

[0106] like Figure 9 As shown, the vibrating element 84 includes a vibrating body 81 , a plurality of electrodes arranged on the vibrating body 8...

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Abstract

Provided is a method for manufacturing a resonator element. Provided is a method for manufacturing a resonator element with which it is possible to obtain stable vibration characteristics with little variation in groove depth. In the manufacturing method of the vibrating element, the vibrating element comprises a base part, and a first vibrating arm and a second vibrating arm which extend from the base part along a first direction and are arranged along a second direction crossing the first direction, and two main surfaces of the first vibrating arm and two main surfaces of the second vibrating arm are provided with grooves with bottoms. The manufacturing method includes: a preparation step of preparing a quartz substrate; a protective film forming step of forming a protective film in a region of the quartz substrate other than a groove region in which the groove is formed; and a dry etching step of performing dry etching on the quartz substrate via the protective film to form the grooves, the grooves provided on at least one of the first vibrating arm and the second vibrating arm including a first groove and a second groove arranged along the second direction.

Description

technical field [0001] The present invention relates to a method of manufacturing a vibrating element. Background technique [0002] For example, Patent Document 1 describes a method of forming a tuning fork resonator having a bottomed groove by dry etching. Specifically, the groove width is set to be narrower than the distance between the pair of vibrating arms by utilizing the micro-load effect in the dry etching process, so that the etching depth between the vibrating arms is processed deeper, and the etching depth of the groove is processed The outer shape and groove of the tuning fork vibrator are formed together. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2007-13382 [0004] However, when the groove is formed by the micro-loading effect as in Patent Document 1, there is a correlation between the etched groove depth and the groove width. Therefore, when the groove width is set to a predetermined size, it may be difficult to obtain The problem of groove...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H10N30/082H10N30/85
CPCH03H3/02H03H9/0547H03H9/0519H03H9/215H03H2003/026H03H9/02157H03H9/2473G01C19/5628H10N30/082G01C19/5621H03H9/19
Inventor 坂田日和小林琢郎西泽龙太山口启一白石茂
Owner SEIKO EPSON CORP