Preparation method of photosensitive component, camera module and circuit board
A technology for photosensitive components and circuit boards, which is used in electrical components, image communications, color TV components, etc.
Pending Publication Date: 2022-08-02
NINGBO SUNNY OPOTECH CO LTD
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[0008] However, due to the material characteristics, that is, the ink will shrink during baking and curing, and the main body of the circuit board will expand during baking and curing, resulting in a downwardly curved structure of the circuit board after molding, such as figure 1 As shown, that is, the bottom surface of the imaged circuit board is a downward curved surface rather than a flat surface
[0009] Correspondingly, when a circuit board with a downward bending structure is applied to a camera module, many problems will be encountered. For example, when the camera module is assembled in an electronic device, the protruding part of the circuit board is vulnerable to collision, which Not only will it cause further deformation of the circuit board, but the photosensitive chip electrically connected to the circuit board will also be implicated
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[0047] Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.
[0048] Application overview
[0049] As previously mentioned, due to the material properties, ie, the ink shrinks when it is baked and cured, and the circuit board body expands when it is baked and cured, causing the circuit board to have a downwardly curved structure after molding. Correspondingly, when the circuit board with the downward bending structure is applied to the camera module, many problems will be encountered.
[0050] First, the photosensitive chip is usually mounted on the upper surface of the circuit board through an adhesive. Corres...
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Abstract
The invention discloses a preparation method of a photosensitive assembly, a camera module and a circuit board. The photosensitive component comprises a circuit board; the photosensitive chip is electrically connected to the circuit board, and the reinforcing part is formed on the lower surface of the circuit board; wherein the height of the lower surface of the reinforcing part is lower than the height of the lowest part in the lower surface of the circuit board, so that the lower surface of the circuit board is prevented from being in contact with a mounting plane when the photosensitive component is mounted on the mounting plane.
Description
technical field [0001] The present application relates to the field of circuit boards, and in particular, to a preparation method of a photosensitive component, a camera module and a circuit board. Background technique [0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users acquire images (eg, videos or images) have been rapidly developed and advanced. [0003] The circuit board can provide mechanical support for the fixing and assembly of various electronic components such as integrated circuits, and realize the wiring and electrical connection or electrical insulation between various electronic components. It is a very important basic component in the camera module. The existing circuit board manufacturing process is generally: on an insulating base material, a printed circuit, a printed element or a conductive pattern formed by combining the two is made according to a predete...
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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/50H04N23/57H04N23/55
Inventor 褚水佳张银波鲁晓峰成胜
Owner NINGBO SUNNY OPOTECH CO LTD