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Lighting device

A technology of lighting device and light irradiation device, which is applied in the directions of electrical components, electrical solid-state devices, circuits, etc., can solve the problem of the size of the substrate 1 becoming larger and the like

Inactive Publication Date: 2005-08-31
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since the light-emitting element 2 is composed of an assembly assembled with the resin package 7, the leads 3, 4, etc., there is a disadvantage that the size of the substrate 1 on which it is mounted becomes large.

Method used

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Examples

Experimental program
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Embodiment 2

[0094] Embodiment 2 is characterized in that the metal substrate 71A on which the light irradiation device 68 is mounted has a bent portion 71B bent upward to reflect light from the light irradiation device 68 (optical semiconductor element 25 ) at its peripheral portion. The light from the optical semiconductor element 25 is further irradiated upward through the bent portion 71B. In addition, this bent portion 71B is formed by extruding with a press or the like.

[0095] A flat portion is formed at the end of the bent portion 71B, and a transparent plate 73 such as a glass substrate is placed on the flat portion, and in this state, the metal substrate 71A and the transparent plate 73 are fixed with a mounting member 74 such as a rubber seal. Thus, the lighting device 40A is completed as a light emitting panel having a desired size. In addition, dry air is sealed in the lighting device 40A. In addition, screw fasteners may be used as fixing means for fixing the metal substra...

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PUM

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Abstract

A lighting device using a light-emitting device with improved heat dissipation is offered. A lighting device with a light-emitting device mounted on a metal substrate (71) is offered. The light-emitting device consists of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51A, 51B) and a transparent resin (67) covering the optical semiconductor element. (25) and supporting the conductive passages (51A, 51B) in one piece. The method provides a light-emitting device consisting of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51B) and a transparent resin (67) covering the optical semiconductor element (25) and supporting the conductive passages (51A, 51B) in one piece.

Description

technical field [0001] The present invention relates to a lighting device, and in particular to a lighting device using a light irradiation device with good heat dissipation. Background technique [0002] First, when it is necessary to irradiate a large amount of light, an electric lamp or the like is generally used. However, if Figure 10 As shown, light-emitting elements 2 are sometimes mounted on a printed circuit board 1 in order to pursue lightness, compactness and power saving. [0003] The light-emitting element is mainly a light-emitting diode (Light Emitting Diode) formed of a semiconductor, and a semiconductor laser or the like is also considered. [0004] This light-emitting element 2 has prepared two lead wires 3,4, on one lead wire 3, fix the back side (anode or cathode) of light-emitting diode 5 with solder etc. The surface electrodes (cathode or anode) are electrically connected. A transparent resin package 7 encapsulating the leads 3 and 4, the light emitt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64
CPCH01L2224/45144H01L2224/48091H01L2924/12041H01L2224/48247H01L33/647H01L2924/00014
Inventor 坂本则明小林义幸
Owner SANYO ELECTRIC CO LTD