Low-intensity magnetic field sensor using printed circuit board mfg. thchnology and its mfg. method
A technology of printed circuit board and manufacturing technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc.
Inactive Publication Date: 2005-10-26
SAMSUNG ELECTRO MECHANICS CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0009] Therefore, the inventor conducted research to solve the above-mentioned problems, and as a result, the inventor developed a novel weak magnetic field sensor using printed circuit board manufacturing technology and its manufacturing method, which can meet the demands for miniaturization and reduction in power consumption
Method used
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Embodiment Construction
[0021] The present invention will be further illustrated by examples in conjunction with the accompanying drawings.
[0022] figure 1 with 2 are exploded perspective and cross-sectional views of an embodiment of a weak magnetic field sensor using printed circuit board manufacturing techniques according to the present invention.
[0023] As shown in the figure, the weak magnetic field sensor using printed circuit board manufacturing technology according to the present invention includes: a magnet 1 formed with a pattern of a certain shape, a first stacked board 10 having a driving pattern 3 and stacked under the magnet 1, A second stacking board 20 stacked on top of the magnet 1 , and a pair of third stacking boards 30 having a pick-up pattern 5 stacked under the first stacking board 10 and above the second stacking board 20 .
[0024] Specifically, a first stacking plate 10 is stacked on the underside of the pair of parallel-placed sheet-shaped magnets formed with a pattern,...
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Abstract
A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.
Description
field of invention [0001] The invention relates to a weak magnetic field sensor using printed circuit board manufacturing technology and its manufacturing method, in particular to a weak magnetic field sensor using printed circuit board manufacturing technology that is suitable for being installed on a mobile communication terminal for detecting the earth's magnetic force to obtain position information. Magnetic field sensor and manufacturing method thereof. Background technique [0002] With the development of mobile phones and mobile terminals, among the various additional services currently provided, the location information service is gradually established as an important service, and more detailed and convenient services are required in the future. [0003] In order to obtain positioning information, it is necessary to provide a sensor that can accurately find out the current position. A weak magnetic field sensor is used as the device for providing positioning informa...
Claims
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IPC IPC(8): G01R33/04G01R33/02G01R33/05H01F17/04H01L43/02H05K1/16H05K3/46
CPCH05K2201/10416H05K2201/086H05K2201/09536H05K3/4602G01R33/05H05K3/4652H05K1/165G01R33/02H10N50/80
Inventor 姜明杉罗敬远崔相彦崔源悦李政桓朴建阳
Owner SAMSUNG ELECTRO MECHANICS CO LTD