Ultra-precise silicon wafer positioning system with balance weight damping apparatus

Abstract

It is ultra-fine silicon pad position system with balance damping apparatus, which uses conservation of momentum principle and put the silicon pad supporting apparatus and its guide apparatus on a balance block with X, Y freedom degree supported by a float axis. When the silicon supporting apparatus moves along one direction, the balance block moves oppositely and eliminates the vibration caused by move reaction. The system also has a momentum wheel system used to eliminate the vibration caused by the momentum distance non-conservation in the moving surface of the silicon pad supporting apparatus. The whole system is supported by three air elastic spring and absorbs the remaining vibration of rest three freedom degrees and further improves the moving accuracy of the silicon pad position system.

Description

technical field [0001] The invention relates to an ultra-precise motion positioning system for silicon wafers in the photolithography process, in particular to an ultra-precise silicon wafer positioning system with a vibration elimination device. The system can be used for scanning photolithography machines, It can also be used in stepper lithography machines. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). The resolution and exposure efficiency of the lithography machine greatly affect the characteristic line width (resolution) and productivity of the integrated circuit chip. As the main component of the lithography machine, the motion accuracy and work efficiency of the silicon...

AI Technical Summary

Problems solved by technology

The main difference between the two is that the scanning lithography machine has a mask motion positioning system that can perform large-scale scanning motion positioning, while the stepping lithography machine does not

[0009] The above two methods for eliminating vibration by the principle of conservation of motion momentum have their own shortcomings: the method proposed in the patent US6359679 uses two linear motors in the same direction of motion, resulting in an increase in the volume of the positioning system, and at the same time due to the increase in drive elements and the The distance from the silicon wafer or the mask is relatively close, making it more difficult to control the temperature around the silicon wafer or the mask; although the method used in the patent EP1111469 avoids the above-mentioned problems, the method is in the process of realizing the conservation of momentum. Keep the conservation of angular momentum in the plane of motion, so that the entire balance mass is in a free state in the plane. Since the driving and guiding devices of the wafer stage are installed on the balance mass, the slight rotation of the mass in the plane of motion will affect Silicon wafer positioning accuracy

[0011] However, this invention does not involve how to eliminate the impact of the vibration on the entire lithography machine due to the high-speed and high-acceleration movement of the motion positioning unit during the exposure process

Images