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Photosensitive resin composition for photoresist

A technology of photosensitive resin and composition, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment, and can solve problems such as decreased transparency

Inactive Publication Date: 2006-06-28
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the photosensitive resin composition used for the interlayer dielectric as described above is thick, the decrease in transparency becomes a problem as the film thickness increases.

Method used

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  • Photosensitive resin composition for photoresist
  • Photosensitive resin composition for photoresist
  • Photosensitive resin composition for photoresist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] Preparation of photosensitive resin composition

[0092] With 100pbw of the polymer solution (copolymer [A-1)) obtained by Synthetic Example 1 and 25pbw of the condensate obtained by Synthetic Example 6, [4,4'-[1-[4-[1-[4 -Hydroxyphenyl]-1-methylethyl]phenyl]ethylene]bisphenol 1,2-naphthoquinone diazide-5-sulfonate] mix, dissolve in propylene glycol monomethyl ether acetate, make The solid concentration was 35% by weight, and then filtered with a 0.2 μm microporous filter to prepare a solution of the photosensitive resin composition.

[0093] Regarding the photosensitive resin composition prepared above, its physical properties were evaluated in the following manner, and the results are shown in Table 1 below.

[0094] 1) Sensitivity: The above composition solution was applied onto a glass substrate by using a spinner and prebaked on a hot plate at 90° C. for 2 minutes to form a film.

[0095] Through a mask with a predetermined pattern, the film obtained above was ex...

Embodiment 2

[0101] The composition solution was prepared according to the same method as used in Example 1, except that the polymer solution prepared in Synthesis Example 2 was used instead of the polymer solution prepared in Synthesis Example 1, and its physical properties and results were evaluated as follows Table 1.

Embodiment 3

[0103] The composition solution was prepared according to the same method as used in Example 1, except that the polymer solution prepared in Synthesis Example 3 was used instead of the polymer solution prepared in Synthesis Example 1, and its physical properties and results were evaluated as follows Table 1.

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Abstract

The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate copolymer obtained by selectively using specific compounds or controlling the ratio of unreacted monomers, and a 1,2-quinonediazide compound, which is excellent in several performance factors such as dielectric characteristics, flatness, transparency, developing performance, residual film rate, chemical resistance, and heat resistance, as well as sensitivity and resolution, and in particular it facilitates easy pattern formation into interlayer dielectrics, and it can be used as a photoresist in an LCD manufacturing process due to its excellent transmissivity even when prepared as a thick film.

Description

technical field [0001] The present invention relates to the photosensitive resin composition that is used as photoresist in LCD manufacturing process, particularly relates to the photosensitive resin composition that contains the acrylate copolymer of unsaturated ethylenic bond, and this composition is in such as: dielectric property, smoothness and Excellent in several properties of chemical resistance, this composition promotes easy pattern formation, and has excellent transmittance, and this composition is suitable for forming interlayer dielectrics in liquid crystal display elements, integrated circuit elements, and the like. Background technique [0002] TFT liquid crystal display elements or integrated circuit elements use interlayer dielectrics to insulate wiring spaces located between layers from each other. In order to form such an interlayer dielectric, a photosensitive material having excellent smoothness and reducing the processing steps necessary to obtain an in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/033C08F216/36C08L33/02G03F7/022G03F7/023G03F7/027G03F7/038H01L21/027
CPCG03F7/027G03F7/023G03F7/038G03F7/022
Inventor 金柄郁赵俊衍权京一朴洙晶俞载元
Owner DONGJIN SEMICHEM CO LTD