Dipping-sealing wax for electronic element coil

Abstract

The invention relates to a kind of impregnation enveloping wax combination used for electronic components, which contains petroleum wax, petroleum resin, and adhesion promoter. The impregnation enveloping wax of the invention has the advantages such as high drop melting point, excellent high-temperature property, fine electrical property, low melting viscosity, good adhesivity, fine moisture resistance, and so on. Coil impregnation-enveloping materials for exclusive use to existing technology electronic components all take resin as main materials, and the impregnation-enveloping materials have higher cost. The impregnation encapsulating wax of the invention adapts to the impregnation and envelopment of inductance coil, mid-frequency and high frequency electric coil, and other electronic components.

Description

technical field [0001] The invention relates to an impregnating and encapsulating wax, which is especially suitable for impregnating and encapsulating inductance coils, intermediate frequency and high frequency electronic coils and other electronic coils. Background technique [0002] In the production of inductance coils, it is necessary to fill the coil gap with impregnated encapsulating wax, and at the same time encapsulate the coils. The prior art generally only uses commercial paraffin wax or microcrystalline wax. Although the price is cheap, it has defects such as poor high-temperature performance and toughness and plasticity. Introduction of prior art The materials used for sealing coils dedicated to electronic components all use resin as the main component. For example, in the sealing methods introduced in US 4115175 and US 5656350, resins are used to encapsulate coils. For the increasingly competitive electronic market, it is difficult to meet the requirements of u...

AI Technical Summary

Problems solved by technology

The prior art generally only uses commercial paraffin wax or microcrystalline wax. Although the price is cheap, it has defects such as poor high-temperature performance and toughness and plasticity. It is easy to lose at working temperature and easy to break under external force.

Introduction of prior art The materials used for sealing coils dedicated to electronic components all use resin as the main component. For example, in the sealing methods introduced in US 4115175 and US 5656350, resins are used to encapsulate coils. For the increasingly competitive electronic market, it is difficult to meet the requirements of users to pursue high cost performance, and the toughness and plasticity of resin impregnated encapsulation materials are also poor