Energy transfer method and device with unidirectional airflow and hollow cavity

Abstract

An energy transfer method and device with unidirectional airflow and hollow cavity is disclosed. Said device is composed of a thermal superconducting unit installed to a heat source, an assembly of multiple heat radiating fins on said thermal superconducting unit and hollow cavity, the capillary structure on the surface of said hollow cavity, a heat conducting medium in said hollow cavity, and a sealing cover of said hollow cavity. Said assembly has multiple channels for unidirectional airflow to carry out the afterheat.

Description

【Technical field】 [0001] The invention relates to an energy transmission method and device, in particular to an energy transmission method and device for a unidirectional airflow hollow cavity capable of rapidly transmitting temperature. 【Background technique】 [0002] Such as figure 1 As shown, an existing heat dissipation device 1 includes a heat pipe assembly 11 that can be connected to a heat source (not shown), and a heat dissipation fin assembly 12 that is set on the heat pipe assembly 11; the heat pipe assembly 11 includes a bottom plate 111 that can be connected to a heat source, and a heat pipe 112 connected to the bottom plate 111; the heat dissipation fin assembly 12 includes a plurality of heat dissipation fins 121 that are sleeved on the heat pipe 112 and formed to overlap each other , and through the connection bases 122 of the heat dissipation fins 121, the heat dissipation fins 121 are passed through the heat pipes 112 through the connection bases 122, and t...

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Problems solved by technology

[0004] But in fact, because the heat pipe 112 and the heat dissipation fin 121 of the prior art heat sink 1 are manufactured and shaped separately, and then merged and assembled, it takes more man-hours and costs; moreover, because the heat pipe 112 and the The heat dissipation fins 121 belong to different components, which will generate a large contact thermal resistance after the assembly is completed, which will relatively reduce the efficiency of heat conduction; it is worth mentioning that the surrounding sides of the heat dissipation fins 121 of the existing heat dissipation device 1 There is no shielding object on the end edge, which will make the external airflow flow through the channels 13 without a fixed direction, and cannot effectively take away the waste heat remaining on the heat dissipation fins 121, greatly reducing the heat dissipation effect

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