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Semiconductor device

A semiconductor and device technology, applied in the field of semiconductor devices and electronic devices using them, can solve problems such as inability to adapt

Inactive Publication Date: 2007-01-10
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

sometimes can't adapt

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

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Embodiment Construction

[0043] Hereinafter, the present invention will be described with reference to the drawings.

[0044] Figure 1 to image 3 It is a figure explaining the BGA semiconductor device of the first embodiment of the present invention, and FIG. 1 is a top view of a BGA substrate, figure 2 is the back view of the BGA substrate, image 3 It is a cross-sectional view of a main part of a BGA board on which a semiconductor element is mounted.

[0045] In Figure 1 to image 3 Among them, the reference numeral 1 represents the substrate, 2 represents the through hole, 3 represents the wiring pattern, 4 represents the solder joint, 5 represents the position where the semiconductor element is mounted on the central part of the BGA substrate 1, 6 represents the wiring pattern, 7 represents the solder joint, and 8 represents the semiconductor element. , 10 represents a solder ball, 11 represents a power supply solder point, 12 represents a through hole, 13 represents a solder joint, 14 repres...

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PUM

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Abstract

A BGA type semiconductor device which realizes its high speed operation and high integration density by shortening power supply or grounding wires to reduce its inductance. In the BGA type semiconductor device, the power supply or grounding wires are provided in the vicinity of the center of a BGA board to realize the high-speed operation and high integration density, whereby an electronic circuit or equipment using the BGA type semiconductor device can be made high in operational speed and made sophisticated in function.

Description

technical field [0001] The present invention relates to a semiconductor device and an electronic device using the same, in particular to an ultra-high-speed operation or ultra-high integration semiconductor device and an electronic device using the same. Background technique [0002] The progress of electronic circuits and electronic devices is astonishing, especially in recent years, the speed of operation and integration of which have continued to increase significantly. Once the speed of electronic devices is increased, various processes can be realized simply and inexpensively. In addition, complex functions are possible due to increased integration. This tendency is particularly remarkable for semiconductor devices. In this way, the progress and development of the electronics industry has been promoted due to the increase in operating speed and high integration of electronic circuits, electronic devices and semiconductor devices. [0003] Semiconductor elements are h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12H01L23/48H01L23/498
CPCH01L23/49838H01L2924/15311H01L2224/48235H01L2924/3011H01L2924/19041H01L24/48H01L2924/30107H01L2924/15173H01L2924/00014H01L2224/45099H01L2224/05599H01L2224/85399H01L2224/45015H01L2924/207H01L23/50
Inventor 山村英穗
Owner RENESAS ELECTRONICS CORP
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