Rare earth-containing tin-base lead-less brazing alloy and its prepn

A lead-free solder, tin-based technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of complicated preparation process, weakening bonding strength, and rising solder cost.

Inactive Publication Date: 2002-02-27
YIYUAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as a result of the addition of In, irregular needle-like dendrites are formed in the microstructure, which reduces the mechanical strength and consequently weakens the final bond strength
At the same time, the content of In in the earth's crust is low and the price is high, and its addition will inevitably bring about a substantial increase in the cost of solder
In the preparation method of solder, Chinese patent CN 1292316A discloses a preparation method of rare earth-containing tin-based lead-free solder, which is characterized in that it adopts a two-step smelting method. The first step is to smelt rare earth and Sn into a master alloy Finally, in the second step, the master alloy of rare earth and Sn is added to the final smelted alloy, and the whole preparation process is relatively complicated.

Method used

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  • Rare earth-containing tin-base lead-less brazing alloy and its prepn
  • Rare earth-containing tin-base lead-less brazing alloy and its prepn
  • Rare earth-containing tin-base lead-less brazing alloy and its prepn

Examples

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Effect test

example 1

[0016] Example 1: Weigh 130 grams of potassium chloride and 100 grams of lithium chloride into an alumina crucible, mix well, heat and melt to 600 ° C, pour molten salt on 95.5% pure tin to completely melt the tin, at 450 At ℃, add 4% Zn into the molten tin liquid, and at the same time stir continuously to melt Zn; quickly press 0.5% rare earth into the molten mixed salt and Sn-Zn alloy, stir and melt; keep warm for 30 minutes, Let it stand for 10 minutes and then take it out of the furnace to cool, and remove the mixed salt of potassium chloride and lithium chloride on the surface after solidification. Reheat and melt the brazing filler metal to 350°C, pour the molten brazing solution on the slightly inclined angle steel, and let it cool rapidly into strips for use.

example 2

[0017] Example 2: Weigh 130 grams of potassium chloride and 100 grams of lithium chloride into an alumina crucible, mix well, heat and melt to 600°C, pour molten salt on 93.8% pure tin to completely melt the tin, at 450 At ℃, add 6% Zn into the molten tin liquid while stirring continuously to melt Zn; quickly press 0.2% rare earth into the molten mixed salt and Sn-Zn alloy, stir and melt; keep warm for 30 minutes, Let it stand for 10 minutes and then take it out of the furnace to cool, and remove the mixed salt of potassium chloride and lithium chloride on the surface after solidification. Reheat and melt the brazing filler metal to 350°C, pour the molten brazing solution on the slightly inclined angle steel, and let it cool rapidly into strips for use.

example 3

[0018] Example 3: Weigh 130 grams of potassium chloride and 100 grams of lithium chloride into an alumina crucible, mix well, heat and melt to 600 ° C, pour molten salt on 91.95% pure tin to completely melt the tin, at 450 At ℃, add 8% Zn into the molten tin liquid, while stirring continuously to melt Zn; quickly press 0.05% rare earth into the molten mixed salt and Sn-Zn alloy, stir and melt; keep warm for 30 minutes, Let it stand for 10 minutes and then take it out of the furnace to cool, and remove the mixed salt of potassium chloride and lithium chloride on the surface after solidification. Reheat and melt the brazing filler metal to 350°C, pour the molten brazing solution on the slightly inclined angle steel, and let it cool rapidly into strips for use.

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Abstract

The present invention relates to a tin base lead-free solder containing rare earth and its preparation method. It contains 4-10 % of Zn, 0.05-1% of Re, and the rest is Sn. Its preparation method includes the following steps: heating mixed salt formed from potassium chloride and lithium chloride according to the weight ratio of 1.3:1 to 500-600 deg.C to make them melt; pouring the above-mentioned melted material on the tin, after the tin is completely metal, adding zinc 5o molten tin to make Zn melt, then quickly pressing rare earth into the molten mixed salt and Sn-Zn alloy, heat-insulating at 400-500 deg.C, standing still, after the above-mentioned material is coagulated, removing surface mixed salt. The invented solder possesses excellent anti-corrosive property, and can be extensively used in the electronic industry.

Description

1. Technical field [0001] A rare earth-containing tin-based lead-free solder and a preparation method thereof belong to the technical field of tin-based lead-free solder manufacture. 2. Background technology [0002] As a new type of lead-free solder for electronic connection, it needs to have good corrosion resistance. Traditional SnZn solder alloys have poor corrosion resistance. In order to solve its corrosion resistance problem, the (72.28-89.4)Sn-(6.7-19.2)Zn-(2.7-19.4)In proposed in US Patent 5,242,658 solves the oxidation of Zn by adding In to the traditional Sn-Zn alloy and corrosion and dross formation issues. However, as a result of the addition of In, irregular needle-like dendrites were formed in the microstructure, thereby reducing the mechanical strength and consequently weakening the final bonding strength. At the same time, the content of In in the earth's crust is low and the price is high, and its addition will inevitably bring about a substantial increa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22
Inventor 史耀武夏志东陈志刚雷永平李晓延刘建萍张秀英穆楠
Owner YIYUAN ELECTRONICS TECH
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