Solder-free brazing filler metal paste for copper-aluminum dissimilar metal brazing and brazing method

A technology of dissimilar metals and brazing methods, applied in metal processing equipment, welding/cutting media/materials, welding/welding/cutting items, etc., can solve problems such as polluting the environment, volatile flux, and endangering human health

Active Publication Date: 2021-11-02
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the use of flux is likely to produce pores and inclusions in the weld, thereby greatly reducing the corrosion resistance of the joint; Difficult to slag
In addition, in brazing, the flux is volatile, pollutes the environment, and endangers human health; the residual flux residue is highly corrosive and easily corrodes copper-aluminum joints, affecting the service life of copper-aluminum joints

Method used

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  • Solder-free brazing filler metal paste for copper-aluminum dissimilar metal brazing and brazing method
  • Solder-free brazing filler metal paste for copper-aluminum dissimilar metal brazing and brazing method
  • Solder-free brazing filler metal paste for copper-aluminum dissimilar metal brazing and brazing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The solder paste for copper-aluminum dissimilar metal flux-free brazing of the present embodiment is composed of the following components by weight: 0.1 part of AlTiB particles, 1 part of Si powder, 1 part of P powder, 60 parts of Zn85Al15 solder powder, 8 parts of binder.

[0042] The mass percent of each component in the AlTiB particle is: Ti 5%, B 1.5%, Al 93.5%; the particle diameter is 30-80 μm.

[0043] The binder is composed of ethyl cellulose, ethyl acetate, and ethanol in a mass ratio of 1.5:3:4.

[0044] The preparation method of solder paste: first dissolve ethyl cellulose into ethyl acetate and ethanol mixture, stir to make a binder, then add AlTiB particles, Si powder, P powder, and Zn85Al15 solder powder to prepare a paste.

Embodiment 2

[0046] The solder paste for copper-aluminum dissimilar metal flux-free brazing of the present embodiment is made up of the following components by weight: 0.2 parts of AlTiB particles, 2 parts of Si powder, 2 parts of P powder, 65 parts of Zn85Al15 solder powder, 10 parts of binder.

[0047] The mass percent of each component in the AlTiB particle is: Ti 6%, B 2%, Al 92%. The particle diameter is 30-80 μm.

[0048] Binding agent is with embodiment 1.

Embodiment 3

[0050] The solder paste for copper-aluminum dissimilar metal flux-free brazing of the present embodiment consists of the following components by weight: 0.3 parts of AlTiB particles, 3 parts of Si powder, 3 parts of P powder, 70 parts of Zn85Al15 solder powder, 12 parts of binder.

[0051]The mass percent of each component in the AlTiB particle is: Ti 8%, B 3%, Al 89%. The particle diameter is 30-80 μm.

[0052] Binding agent is with embodiment 1.

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Abstract

The invention belongs to the field of brazing materials, and particularly relates to a solder-free brazing filler metal paste for copper-aluminum dissimilar metal brazing and a brazing method. The brazing filler metal paste is composed of a binder and the following components of, in parts by weight, 0.1-0.5 part of AlTiB particles, 1-3 parts of Si powder, 1-3 parts of P powder and 60-80 parts of Zn85Al15 brazing filler metal powder. The brazing filler metal paste, the Si powder and the Zn85Al15 powder react to form the ternary eutectic brazing filler metal, the Si powder can abstract oxygen and inhibit oxidation of aluminum base metal and molten brazing filler metal, the P powder can also deoxidize to remove an oxidation film on the surface of copper, the molten brazing filler metal wets, spreads and fills gaps, brazing flux-free brazing of copper and aluminum dissimilar metal in the atmospheric environment can be achieved, in addition, Si can restrain diffusion of Cu and Al atoms and reduce production of brittle compounds on the copper side of a connector, AlTiB particles can effectively refine an Si-containing brazing filler metal copper-aluminum connector structure, the obtained brazing seam structure is refined, and the strength of the connector is higher.

Description

technical field [0001] The invention belongs to the field of brazing materials, and in particular relates to a solder paste for brazing of copper-aluminum dissimilar metals without flux and a brazing method. Background technique [0002] Copper has excellent thermal conductivity and electrical conductivity, while aluminum's thermal conductivity and electrical conductivity are second only to copper, but it has the advantages of low density, high specific strength and low price. With the rapid development of industry, light weight, energy saving, and environmental protection have become the development themes. The use of copper-aluminum dissimilar metal composite structures can not only relieve the pressure on copper resources, but also make full use of their respective performance advantages, such as weight reduction, cost reduction, energy Therefore, the brazing connection of copper and aluminum dissimilar metals is inevitable. [0003] At present, the copper side of the co...

Claims

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Application Information

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IPC IPC(8): B23K35/00B23K35/02B23K35/28B23K35/40B23K1/00
CPCB23K35/007B23K35/288B23K35/025B23K35/40B23K1/00B23K35/282B23K1/20B23K1/002B23K2103/18
Inventor 钟素娟黄俊兰裴夤崟程亚芳路全彬聂孟杰张陕南李文彬
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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