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Camera assemblage

A camera and component technology, applied to cameras, camera bodies, electrical components, etc., can solve problems such as abnormal work and damage of semiconductor chips

Inactive Publication Date: 2003-06-18
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when electrostatic charge is transferred to the semiconductor chip accommodated in the lens holder 93, the semiconductor chip may malfunction or be damaged.

Method used

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  • Camera assemblage
  • Camera assemblage
  • Camera assemblage

Examples

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Embodiment Construction

[0030] The invention will be described below by way of exemplary embodiments with reference to the accompanying drawings. Wherein the same elements are always provided with the same reference numerals and their detailed description is not repeated.

[0031] figure 1 is a perspective view of a camera assembly 100 according to an embodiment of the present invention. figure 2 is a plan view of the camera module 100 . The camera module 100 can obtain a clear image even when subjected to an external force such as an impact.

[0032] The camera assembly 100 includes a lens holder 3 . The lens holder 3 includes a holder base 4 having a generally rectangular parallelepiped shape, and a generally hollow cylindrical lens connecting portion 5 disposed on a central portion of the top surface of the holder base 4 . The outer diameter of the lens connecting portion 5 is about 9mm. The camera assembly 100 includes a sensitive element 1 having a generally cuboid shape and smaller than ...

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Abstract

A camera module includes a solid-state imaging device; a lens unit having a lens for guiding light to the solid-state imaging device; a lens holder for holding the solid-state imaging device, the lens holder including a lens coupling section provided for adjusting the position of the lens, such that a distance between the lens and the solid-state imaging device becomes a prescribed focusing distance; and a shield cap for covering the lens coupling section and the lens unit so as to allow the light to be guided to the lens in the lens unit.

Description

technical field [0001] The present invention relates to a camera module, and more particularly, to a camera module, such as a complementary metal oxide semiconductor (CMOS) camera module, including a holder for fixing a solid-state imaging device and a lens. Background technique [0002] The CMOS camera module includes a lens holder that holds a solid-state imaging device such as a charge-coupled device (CCD), and a lens unit having a lens that guides light to the solid-state imaging device. The CMOS camera module has been widely used, for example, with on cellular phones or mobile terminals. [0003] Figure 10 A method of assembling a conventional CMOS camera assembly 90 is shown. The CMOS camera module 90 includes a sensitive element 1 such as a CCD as a solid-state imaging device, has a lens unit 2 that guides light to the sensitive element 1 , and a lens holder 93 that fixes the sensitive element 1 and the lens unit 2 . The lens holder 93 includes a holder base 94 hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/02G03B17/02H01L27/14H04N5/225H04N5/232H04N5/335
CPCH04N5/2254H04N5/2257H04N23/57H04N23/55
Inventor 谷田好范坂井健二
Owner SHARP KK