Kit containing snack food and dip-condiment
A kit and snack technology, applied in the field of kits containing multiple snack chips and dips, can solve the problem of low space utilization and bulk density of snack chips and dips, low space utilization and packaging density, low space utilization, etc. question
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example 1
[0100] In a particular embodiment, canister 20 is about 11.5 fluid ounces (0.340 liters), has a height H of about 3 7 / 16 inches (87.3 mm), and a diameter D of about 3 inches (76.2 mm).
[0101] In a preferred embodiment, the kit 10 includes 106 grams of product, namely 50 grams of snack chips 30 in a canister 20 detachably connected to a dip box 40 containing 56 grams of dip 50 . Kit 10 in this example has 0.25g / cm 3 space utilization. This optimization can not only make the kit 10 stable when shelved, but also have high space utilization and acceptable shelf appearance.
example 2
[0103] In a specific embodiment, can 20 is about 11.5 fluid ounces (0.58 liters), has a height H of about 5 19 / 32 inches (142 mm), and a diameter D of about 3 inches (76.2 mm).
[0104] In another embodiment, the kit 10 includes 212 grams of product, ie, 100 grams of snack chips 30 in a canister 20 releasably connected to a dip box 40 containing 112 grams of dip 50 . Kit 10 in this example has 0.27 g / cm 3 space utilization. This optimization can not only make the kit 10 stable when shelved, but also have high space utilization and acceptable shelf appearance.
[0105] Figure 11 Another embodiment of kit 10 is shown. In this embodiment, kit 10 is triangular in shape. It includes a can 20 , a plurality of triangular snack pieces 30 contained in the can 20 , a triangular box 40 , a dip 50 contained in the box 40 and a wrapping tape 60 for detachably connecting the box 40 and the container 20 .
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap