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Chipset cooling device of video graphic adapter card

A technology for cooling equipment and video images, which can be used in lighting and heating equipment, cooling/ventilation/heating transformation, instruments, etc., and can solve problems such as narrow spacing

Inactive Publication Date: 2003-10-22
ZALMAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, installing such a large, high-performance heatsink is not feasible due to the typically narrow spacing between cards

Method used

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  • Chipset cooling device of video graphic adapter card
  • Chipset cooling device of video graphic adapter card
  • Chipset cooling device of video graphic adapter card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] Referring to the accompanying drawings, various embodiments of a chipset cooling device for a Video Graphics Adapter (VGA) card according to the present invention will be described in detail.

[0051] refer to figure 1 , which is a perspective view of a chipset cooling device for a VGA card according to a first embodiment of the present invention. The chipset cooling device 52 includes: a first heat sink 18, which is connected to the chipset C ( figure 2 shown), wherein the chipset C is mounted on one surface of the printed circuit board (PCB) 14 of the VGA card 10; the second heat sink 20 is mounted on the other surface of the PCB 14 and spaced from the surface of the PCB 14 Preset distance; heat pipe 22 connecting first and second fins 18 and 20 .

[0052] As everyone knows, the VGA card 10 is inserted into the card connection port 48 ( Figure 6 shown) and is controlled by a central processing unit (CPU). Terminals 24 are formed on one edge of PCB 14 and connect...

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PUM

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Abstract

A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device of a VGA card, two heatsinks are mounted on opposite surfaces of a printed circuit board (PCB) of the VGA card, respectively, and connected together by a heatpipe. Due to the use of two heatsinks to collectively cool a chipset, cooling efficiency is higher as opposed to using a single heatsink. In particular, a binding portion between a heatsink contacting the chipset of the VGA card and the heatpipe is always positioned at a lower level than a binding portion between the other, opposite heatsink and the heatpipe, thereby further enhancing the heat conduction performance of the heatpipe.

Description

technical field [0001] The present invention relates to a chipset cooling device for a Video Graphics Adapter (VGA) card, which includes two heat sinks respectively mounted on opposite surfaces of the VGA card and jointly cooling the chipset of the VGA card. Background technique [0002] In a computer case, there is a motherboard and a number of cards that plug into the motherboard and are electrically connected to the central processing unit (CPU). A typical example of the card is a VGA card, while a TV card, a sound card, or a communication card may optionally be installed. Said card is inserted into the connection port of the motherboard. [0003] The VGA card processes the video information from the CPU in its own chipset, and transmits the processed information to the display so that the user can see text or images. [0004] The newly released VGA card can realize the processing of computing-intensive images or realize 3-dimensional (3D) games. Such VGA cards take ov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25D1/00G06F15/00F25D9/00F28D15/02G06F1/20H01L23/427H05K7/20
CPCH01L2924/0002H01L23/427F28D15/0275H01L2924/00
Inventor 李祥哲
Owner ZALMAN TECH CO LTD