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Liquid processing apparatus and method thereof

A technology for liquid treatment and liquid treatment, applied in the direction of cleaning methods using liquids, chemical instruments and methods, cleaning methods and utensils, etc.

Inactive Publication Date: 2003-10-22
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, in the conventional liquid processing method, since wafers are processed in units of trays, it is impossible, for example, to take arbitrary wafers from a plurality of trays and process them in one batch.

Method used

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  • Liquid processing apparatus and method thereof
  • Liquid processing apparatus and method thereof
  • Liquid processing apparatus and method thereof

Examples

Experimental program
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Embodiment Construction

[0048] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, it is assumed that a description is given of applying the present invention to a cleaning processing apparatus configured to transport semiconductor wafers (wafers) in batches in series? cleaning? dry.

[0049] figure 1 It is a side view showing the outline of the cleaning treatment device 1, figure 2 From figure 1 A schematic side view seen in the direction of arrow AA shown in . The cleaning processing apparatus 1 includes: a hoop loading / unloading unit 2 on which a hoop (carrier) F for accommodating a wafer W is mounted; a cleaning processing unit 4 for performing cleaning processing on the wafer W; Wafer transfer unit 3 for transferring wafer W to and from cleaning unit 4, power unit 5 for various electric drive mechanisms or electronic control devices installed in cleaning unit 1, storage and supply of chemical solutions for cleaning treatment, ...

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Abstract

A cleaning apparatus 1 includes a foup loading / unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch (half pitch), a wafer transporting device 11 for transporting the wafer E between the foup F and the rotor 34, wafer posture changing devices 20 a, 20 b, a wafer elevating mechanism 40, a motor 31 for rotating the rotor 34, an outer chamber 71 a and an inner chamber 71 b both accommodating the rotor 34, and cleaning liquid nozzles 53, 55 for supplying a cleaning liquid to the wafers W. The rotor 34 holds the wafers W at intervals of an optional pitch (every one holding pitch or every plural holding pitches) to carry out a cleaning operation. Consequently, it is possible to process substrates accommodated in two containers at one batch processing.

Description

technical field [0001] The present invention relates to a liquid processing device and a liquid processing method for applying predetermined liquid processing to each substrate such as a semiconductor wafer and an LCD substrate. Background technique [0002] Generally, in the manufacturing process of semiconductor devices, a prescribed chemical solution is used? Treating liquids such as pure water are used to treat semiconductor wafers (hereinafter referred to as wafers) as substrates, and use wafer liquid processing equipment to remove contamination such as particles, organic pollutants, metal impurities, organic substances, and oxide films from the wafers. [0003] For example, as far as wafer liquid processing apparatus is concerned, it is well known that a plurality of wafers are accommodated in a liquid processing chamber for batch processing. Such an apparatus generally handles wafers in units of trays (wafer storage containers). The tray accommodates a predetermined...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027H01L21/304H01L21/677
CPCH01L21/67781Y10S134/902H01L21/304
Inventor 上川裕二杢尾胜利
Owner TOKYO ELECTRON LTD
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