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Image sensor assembly and its mfg. method

A technology of image sensor and manufacturing method, which is applied in the direction of image communication, electric solid-state devices, semiconductor devices, etc., and can solve the problems of increasing the number of manufacturing processes and parts of image sensor components, and increasing manufacturing costs, etc.

Inactive Publication Date: 2003-12-10
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the prior art described above, it is necessary to prepare the connection cable 204 with the plug 205 and to bond the connection cable 204 to the substrate 201.
Therefore, the number of manufacturing steps and the number of parts of the image sensor module increase, and the manufacturing cost increases.

Method used

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  • Image sensor assembly and its mfg. method
  • Image sensor assembly and its mfg. method
  • Image sensor assembly and its mfg. method

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Embodiment Construction

[0024] Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

[0025] figure 1 An example of the image sensor module of the present invention is shown. The image sensor module X of this embodiment has a substrate 4 , an image sensor chip 5 , a holder 3 , and a lens holder 1 that holds a lens 2 .

[0026] The substrate 4 is made of, for example, glass epoxy resin, and has a long rectangular shape. On the surface (upper surface) of the substrate 4 , an image sensor chip 5 is mounted offset from the center of the substrate 4 toward one end 4 a in the longitudinal direction thereof. The image sensor chip 5 is, for example, a CCD-type or MOS-type solid-state imaging element. like figure 2 As shown, a photosensitive portion 50 and a plurality of electrodes 51 are provided on its upper surface. On the photosensitive part 50, a plurality of photosensitive surfaces in the form of fine dots, not shown in the fig...

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Abstract

An image sensor module (S) includes a substrate ( 4 ) having a projecting portion ( 41 ) projecting sideways from a frame ( 3 ). The projecting portion ( 41 ) has an end ( 4 b) provided with a plurality of terminals ( 81 ) electrically connected to an image sensor chip ( 5 ). The image sensor module (X) can be easily connected to another apparatus by inserting the end ( 4 b) of the projecting portion ( 41 ) into a socket type connector.

Description

technical field [0001] The present invention relates to an image sensor module used as a component of, for example, a digital camera or a mobile phone with a camera, and a method of manufacturing the same. Background technique [0002] Figure 5 An example of a conventional image sensor module is shown. The illustrated image sensor module 100 has a structure in which a holder 103 is mounted on the surface of a substrate 104 on which an image sensor chip 105 is mounted. A lens holder 101 holding a lens 102 is attached to the holder 103 . The light traveling from the object to be photographed passes through the lens 102 , and the image of the object to be photographed is projected on the image sensor chip 105 . On the back surface of the substrate 104, a plurality of terminals 106 electrically connected to the image sensor chip 105 are provided. For example, such an image sensor module 100 is mounted on a main board 107 of a mobile phone, thereby constituting a mobile phone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/02H01L27/14H01L27/146H04N25/00
CPCH01L27/14625H01L27/14618H04N5/2254H01L2224/48091H01L2924/3025H04N5/2253H04N23/55H04N23/54H01L2924/00014H01L2924/00
Inventor 大西弘朗藤本久义
Owner ROHM CO LTD
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