Optical element, optical element chip, and corresponding producing method

A technology for optical elements and manufacturing methods, which is applied in the manufacture of optical elements, optical heads, recording/reproducing by optical methods, etc., and can solve problems such as peeling of optical films
CN1469139AInactive Publication Date: 2004-01-21TOMOEGAWA PAPER CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TOMOEGAWA PAPER CO LTD
Publication Date
2004-01-21
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

Provided is an optical element wafer on which a plurality of optical elements are formed altogether, whose cost can be reduced and in which an optical film is prevented from partly peeling and floating when stuck to a package main body. The optical element wafer 10 comprises a base material preform 30, and a holding material 40 stuck to one of the sides of the base material preform 30. The base material preform 30 has a plurality of base materials 31 formed by dividing the base material preform 30. The optical film 51 is partially stuck to each base material 31.
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Description

technical field

[0001] The present invention relates to an optical element bonded to a housing body for accommodating electronic components, an optical element wafer capable of manufacturing, storing, and transporting a plurality of optical elements in batches, and a corresponding manufacturing method. Background technique

[0002] Conventionally, after accommodating various electronic components in a box-shaped case main body having an opening, a cover for sealing the electronic device (hereinafter, sometimes simply referred to as a "cover") is connected to the opening side end of the case main body. Part bonding, electronic components are accommodated in the case composed of the case body and the cover, and various electronic devices are manufactured. Such an electronic device is used, for example, as a device for an optical pickup or the like.

[0003] In recent years, for devices for optical pickups, for example, it has been proposed to attach a retardation film as an o...

Claims

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