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Liquid spraying method and device, producing method for electrooptical device and basilar plate

A liquid and substrate technology, which is applied in the field of liquid ejection devices, can solve the problem of easy thickening of film thickness, and achieve the effects of small film thickness distribution, improved use efficiency, and reduced waste.

Inactive Publication Date: 2004-02-04
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the viscosity or solid portion of the coating liquid changes depending on the environmental conditions, there is a problem that the film thickness near the rotation center of the substrate tends to become thicker.
[0015] Furthermore, the resist coating device disclosed in JP-A-2000-288455 is also an effective coating device for forming a variety of resists with different densities in a short period of time, but it can be seen that The problem that the film thickness near the rotation center of the substrate tends to become thicker

Method used

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  • Liquid spraying method and device, producing method for electrooptical device and basilar plate
  • Liquid spraying method and device, producing method for electrooptical device and basilar plate
  • Liquid spraying method and device, producing method for electrooptical device and basilar plate

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no. 1 Embodiment

[0087] The first embodiment is a discharge method of spraying a liquid from a nozzle of a droplet discharge head and coating a liquid on a substrate, wherein when the coating region of the substrate is divided into at least two regions, Control is performed so that the discharge amount of the liquid substance to the one divided region is larger than the discharge quantity of the liquid substance to the other divided regions.

[0088] In addition, the first embodiment is also a method of discharging a liquid from a nozzle of a droplet discharge head and coating a liquid on a substrate rotated by a spin coater or on a substrate that has been rotated, and is characterized in that : When divided into at least two areas, an inner area and an outer area, along a circumference located at a predetermined distance from the rotation center of the substrate, the discharge amount of the liquid in the outer area is compared to the amount of liquid in the inner area. The amount of ejection ...

no. 2 Embodiment

[0161] Next, a second embodiment of the liquid material ejection device in the present invention will be described. The discharge device of this second embodiment is a discharge device for discharging a liquid and applying it to a substrate, and is characterized in that it includes a droplet discharge head having a nozzle and a discharge amount adjusting device, the When the discharge amount adjusting device divides the region where the liquid substance is applied on the substrate into at least two regions, it controls the discharge amount of the liquid substance for one of the divided regions to be greater than that for the other divided regions. The ejection amount of the liquid substance is large.

[0162] here, Figure 15 It is a schematic cross-sectional view showing a discharge device 50 for a liquid substance. This liquid discharge device 50 is configured to drop a liquid from a droplet discharge head 58 having a nozzle 58 a and apply it to the substrate 10 . In addi...

no. 3 Embodiment

[0171] The third embodiment is a method of ejecting liquids characterized by the steps (a) and (b) below, using the method of ejecting liquids from the nozzles of a droplet discharge head, applying them to a stationary substrate or rotating A method of coating a resist material by an inkjet method on a substrate.

[0172] In addition, the third embodiment is a liquid discharge method characterized by steps including the following (a) and (b), and is a combination of discharge of a liquid from a nozzle of a droplet discharge head, application of a liquid by spin coating An inkjet method on a substrate that is rotated by an applicator or a method of applying a resist material by a spin applicator.

[0173] (a) Discharging the resist material to the outer area while dividing the imaginary circumference into at least two areas of the inner area and the outer area along an imaginary line located at a predetermined distance from the center of rotation of the substrate, for example ...

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Abstract

In a method and apparatus for jetting a liquid from a nozzle of a droplet jet head and applying it to a substrate, a jet amount of the liquid to any one of at least two divided regions of a coating region of the substrate is controlled to be greater than a jet amount to the other divided regions. A spin coater, for example, can be used to rotate the substrate. In addition, to divide the coating region of the substrate, the substrate can be divided into at least an inside circumferential region and an outside circumferential region positioned at predetermined distances from the center of rotation of the substrate. In this case, the jet amount to the outside region is preferably greater than the jet amount to the inside region. Accordingly, it is able to reduce film thickness distribution to obtain a coating film having a uniform thickness and to enhance utilization efficiency by reducing waste in the liquid substance for coating.

Description

technical field [0001] The present invention relates to a liquid discharge method and a liquid discharge device, and more specifically, to a liquid discharge method and a liquid discharge method that can obtain a coating film of uniform thickness and have high efficiency in the use of the liquid ejection device. Furthermore, the present invention relates to a method of manufacturing a substrate for an electro-optical device and a method of manufacturing an electro-optical device using the above-mentioned method of discharging a liquid substance. Background technique [0002] Hitherto, for semiconductor substrates, liquid crystal display devices, substrates for color filters, etc., spin coating methods, die coating methods, roll coating methods, etc. Application method. Among these coating methods, the spin coating method is generally considered to be the most suitable for forming a uniform coating film as thin as micrometers. [0003] In this spin coating method, a substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16H01L21/00
CPCH01L21/6715G03F7/16
Inventor 川濑智己
Owner SEIKO EPSON CORP