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Element making appts., its making method and electronic appts.

A technology for manufacturing devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, discharge tube/lamp manufacturing, inking devices, etc., and can solve problems such as inability to eject liquids, missing ink dots, etc.

Inactive Publication Date: 2004-05-26
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The nozzle has multiple nozzles, but there may be cases where the liquid cannot be ejected from some of the nozzles due to, for example, clogged holes.
When there are nozzles that cannot eject liquids (non-operating nozzles), when ink dot patterns are formed by ejecting droplets onto the substrate, dot omission occurs

Method used

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  • Element making appts., its making method and electronic appts.
  • Element making appts., its making method and electronic appts.
  • Element making appts., its making method and electronic appts.

Examples

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Embodiment Construction

[0046] Next, the device manufacturing apparatus of the present invention will be described.

[0047] figure 1 It is a schematic perspective view showing an embodiment of the device manufacturing apparatus of the present invention.

[0048]The device manufacturing apparatus of this embodiment includes a droplet discharge device having a discharge head capable of discharging droplets of a liquid material (liquid) containing a functional material.

[0049] exist figure 1 Among them, the device manufacturing device (droplet ejection device) IJ has: a spray head 1 for ejecting liquid droplets of a liquid material, a table top device 2 for supporting a substrate P of a base material for manufacturing a device, and a substrate P is carried in and out ( loading and unloading) to the transport device 3 on the stage device 2, and the control device CONT for controlling the overall operation of the device manufacturing apparatus IJ including the discharge operation of the nozzle head 1...

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Abstract

A device manufacturing apparatus includes a discharge head discharging a droplet containing a functional material, a stage supporting a substrate on which the droplet is discharged, and which is capable of moving relative to the discharge head, a carrier carrying the substrate, a detector detecting a discharge condition of the droplet which is discharged from a discharge nozzle formed in the discharge head, and a controller executing a detection operation by the discharge device during a carrying operation of the substrate.

Description

technical field [0001] The present invention relates to a device manufacturing device and a device manufacturing method having a nozzle capable of ejecting liquid. Background technique [0002] In the past, photolithography was often used as a method for manufacturing devices having fine patterns, but in recent years, a device manufacturing method using a liquid droplet discharge method has attracted attention. This technology is very effective in supporting low-volume, multi-variety production by ejecting liquid materials including functional materials from the head of a droplet ejection device, arranging the materials on a substrate, and forming patterns. As the droplet ejection method of the droplet ejection device, mainly known are: the piezoelectric ejection method in which droplets of a liquid material are ejected by deformation of a piezoelectric element, and the piezoelectric ejection method in which a vapor is rapidly generated by heating. The way the liquid materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13B05C5/00B05C11/10B41J2/125B41J29/393H01J9/02H01J9/227H01J11/12H01J11/22H01J11/24H01J11/26H01J11/34H01J11/42H01L21/00H01L21/027H01L51/50H05B33/10
CPCH01L21/6715H01L21/67253B41J29/393B41J2/125B41J2202/09H05B33/10
Inventor 神山信明高桥隼人
Owner SEIKO EPSON CORP
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