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Ultra-rrequency of increasing resolution ratio in microdeposition controlling system

A technology of deposition system and deposition head, which is applied in the direction of processing and manufacturing, manufacturing tools, additive manufacturing, etc., and can solve problems such as expensive

Inactive Publication Date: 2004-10-06
ULVAC INC
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Spin coating is also an expensive process since most of the fluid material does not remain on the substrate
In addition, the spin-coating process limits the size of the substrate to less than about 12", which makes spin-coating unsuitable for large devices like PLED TVs

Method used

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  • Ultra-rrequency of increasing resolution ratio in microdeposition controlling system
  • Ultra-rrequency of increasing resolution ratio in microdeposition controlling system
  • Ultra-rrequency of increasing resolution ratio in microdeposition controlling system

Examples

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Embodiment Construction

[0059] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0060] The following description of preferred embodiments is merely exemplary in nature and is in no way intended to limit the invention, its application or uses. For purposes of clarity, the same reference numbers have been used in the drawings to identify similar elements.

[0061] Referring now to FIG. 1 , there is shown a microdeposition system 20 including a controller 22 , a deposition head assembly 24 and a substrate assembly 26 . The rotational position or step of the deposition head assembly 24 is adjusted using a rotational position motor 30 and a rotational position sensor 32 . Similarly, the height of deposition head assembly 24 relative to substrate assembly 26 may be adjusted using height adjustment motor 34 and height sensor 36 . The lateral positioning of the deposition head assembly 24 is adjusted using a lateral positioning motor 40 and a lateral positioning sensor 42 .

[0062] On top of the deposi...

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Abstract

A microdeposition system ( 20 ) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head ( 50 ) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller ( 22 ) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head ( 50 ) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of the following applications: U.S. Provisional Patent Application Serial No. 60 / 295,118, filed June 1, 2001, and entitled "Formation of Microstructures Using Piezoelectric Deposition of Liquids on Substrates"; U.S. Provisional Patent Application Serial No. No. 60 / 295,100, filed June 1, 2001, entitled "Formation of Printed Circuit Boards by Piezoelectric Deposition of Liquids on Substrates." Both applications are hereby incorporated by reference. field of invention [0003] The present invention relates to microdeposition systems and, more particularly, to over-clocking in microdeposition systems for the fabrication of printed circuit boards, polymer light emitting diode (PLED) displays, and other devices requiring microdeposition of fluidic materials. Background of the invention [0004] Manufacturers have developed various techniques for fabricating microstructures with small feat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/26B05C5/00B05C9/12B05C9/14B05C11/00B05C11/10B05D3/00B25B11/00B29C67/00B41J2/01B41J2/04B41J2/045B41J2/05B41J2/055B41J3/407B41J3/54H01L21/00H01L21/683H01L23/12H01L51/50H05B33/10H05K1/02H05K3/06H05K3/12H05K13/04
CPCB41J2/04573H01L21/67248B41J2/04505B41J2202/04B41J3/543H01L21/67103H05K3/0008B41J2/0451B41J2/04596H05K3/125B41J2/04581B25B11/005B41J2/04588B41J2/04591H01L21/6715B41J3/407B41J2/04593B41J2/04575B41J2/04H01L21/6838B41J2/04506B41J2202/09B41J2/04558H05K1/0269B29C67/0059H05K2201/09918B41J2/0459B41J2/0456B29C64/112B29C64/188H01L21/20
Inventor 查尔斯·O.·爱德华兹戴维·阿尔伯塔利霍华德·W.·比利奇詹姆斯·米德利滕
Owner ULVAC INC
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