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Laser processing device

A laser processing method, laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc.

Inactive Publication Date: 2005-01-05
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The object of the present invention is to provide a method that can solve the problems that arise when the existing laser processing technology is used to punch holes in the sheet-shaped workpiece, and the problems that arise when the sheet is used as the workpiece for laser processing. Laser processing method

Method used

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Embodiment Construction

[0026] An embodiment of the present invention will be described below with reference to the drawings. In addition, the embodiment shown below is an example of actualization of this invention, and does not limit the technical scope of this invention.

[0027] image 3 It is a perspective view showing the structure of the laser processing device according to the first embodiment of the present invention, Figure 4 is the front view of the device. In addition, the structure of the laser irradiation part is omitted from illustration. The sheet-shaped workpiece to be processed by laser processing is a circuit substrate made of resin or metal sheet. In this embodiment, as a workpiece, especially, a sheet made of an aramid epoxy resin is targeted.

[0028] exist image 3 Among them, the laser processing device 101 is provided as a processing device for drilling tiny through holes on a circuit board 102 of a sheet-shaped workpiece, and performs drilling processing by irradiating ...

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Abstract

The two ends of an article to be processed which is in the form of a sheet are held by means of a fixed clamp and a movable clamp, the article being held by applying bias by means of a biasing cylinder to the movable clamp in a direction such as would separate it from the fixed clamp and hole-forming processing being performed by means of a laser beam. Since the sheet-like article is held under tension, flatness of even a thin sheet can be maintained and since the underneath space is open, there is no reflection of laser light after passing through the holes that are formed and any processing waste can easily be removed.

Description

[0001] This application is a divisional application of the patent application with the application number 98104049.7, and the filing date of the parent application is January 27, 1998, and the title is "Laser Processing Device and Laser Processing Method". technical field [0002] The present invention relates to a laser processing method for performing laser processing such as microhole drilling on sheet-shaped workpieces such as circuit substrates by using laser light. Background technique [0003] figure 1 The structure of the sheet-shaped to-be-processed object holding device in the laser processing apparatus which is a conventional technique is shown. This laser processing device 130 performs laser processing while holding a sheet-shaped workpiece 131 at a predetermined position. [0004] exist figure 1 Among them, the adsorption plate 134 provided on the holding table 133 is provided with a through hole 134a, and the sheet-shaped workpiece 131 placed on the adsorptio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/08B23K26/38H05K3/00
CPCB23K26/381B23K26/0807B23K26/4065B23K26/08B23K26/0853B23K26/406H05K3/0026H05K2203/0165B23K26/4085B23K26/4005B23K26/082B23K26/382B23K26/40B23K2103/16B23K2103/40B23K2103/42B23K2103/50
Inventor 侧友宏和田彰宗行健山本聪治河田正弘中村明子河西研二
Owner PANASONIC CORP
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