Constitutes of technical formula in use for dipping plastic

A technical formula and paste technology, which is applied in the composition field of plastic dipping process formula, can solve the problems of insufficient plastic products and affecting the application range of plastic products, etc.
CN1563178AInactive Publication Date: 2005-01-12ZHEJIANG UNIV

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG UNIV
Publication Date
2005-01-12
Estimated Expiration
Not applicable Β· inactive patent
Patent Text Reader

Abstract

A process formula die carving includes compositions as the follows, 100 kg polyvinyl chloride in paste state, 80-100 kg dicapryl phthalate, 1-5 kg cadmium stearate, 1-5 g barium stearate, 0.5-2 kg bisphenol A and 0.01-1 kg dyestuff. The advantage of the present invention is using paste state polyvinyl chloride as main body, suspending each composition in dicapryl phthalate uniformly, plasticizing in not high temp and having excellent antidegradability.
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Description

technical field

[0001] The invention relates to a composition used in a formula for dipping and molding. Background technique

[0002] With the continuous improvement of the appearance and performance requirements of plastic products used in the hardware industry, the appearance and performance of the original plastic products prepared by injection molding technology cannot meet the requirements of users. In the process of use, the plastic products prepared by the injection molding process are not beautiful and convenient, which affects the further expansion of the application range of plastic products. Contents of the invention

[0003] The purpose of the present invention is to provide a composition for dipping process formula.

[0004] In order to achieve the above object, the present invention takes the following measures:

[0005] Its composition (Kg) is:

[0006] Paste PVC 100

[0007] Dioctyl phthalate 80~100 ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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