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Computer system with heat radiation modules for mounting multiple pumps

A technology for a computer system and a heat dissipation module, which is applied in the field of computer systems, can solve the problems of circulating coolant, shutdown of the computer system, inability to operate the water-cooled heat dissipation module 12, etc., and achieves the effect of speeding up the rotation speed.

Inactive Publication Date: 2005-01-19
MICRO-STAR INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if the pump 24 breaks down, the coolant cannot circulate smoothly in the water tank 26 and the heat pipe 22, and the heat energy generated by the processor 14 cannot be eliminated. As a result, the function of the water-cooled heat dissipation module 12 cannot Volatilize, and then cause the circuit of the processor 14 to burn out, and finally cause the shutdown of the entire computer system 10
Especially now that the operating frequency of the processor 14 is getting higher and higher, and the heat energy generated is also increasing. Once the water-cooled heat dissipation module 12 fails to operate, the processor 14 may be burned in just a few seconds, causing the user to There is simply not enough time to react

Method used

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  • Computer system with heat radiation modules for mounting multiple pumps
  • Computer system with heat radiation modules for mounting multiple pumps
  • Computer system with heat radiation modules for mounting multiple pumps

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Experimental program
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Embodiment Construction

[0011] Firstly, the accompanying symbols in the present invention are explained: 10, 30 computer system, 12, 32 cooling module, 14, 34 processor, 16, 36 memory, 22, 42 heat pipe, 24, 48 pump, 26, 46, 46a, 46b water tank, 38 detection device, 44 cooling device, 50 logic unit, 52 opening, 54 water inlet hole, 56 water outlet hole.

[0012] Please refer to FIG. 2 , which is a schematic diagram of a computer system 30 of the present invention. The computer system 30 includes a processor 34 , a memory 36 , a cooling module 32 and a detector 38 . The processor 34 is used to process programs and data, the memory 36 is used to store programs and data, and the heat dissipation module 32 is used to dissipate the heat energy generated by the processor 34. The heat dissipation module 32 includes a heat pipe 42 and a cooling device 44, and the heat pipe 42 A portion of the section is adjacent to the processor 34 for conducting thermal energy. The cooling device 44 includes a plurality of...

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PUM

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Abstract

It is a computer system, which comprises a processor, a memory and a heat radiation module. The processor is used to process program and data and the memory is used to store program and data; the heat radiation module is used to radiate the heat generated by the processor. The heat radiation module comprises a heat conductive pipe neat to the processor used to conduct heat. And a cooling device comprises multiple connected water boxes, multiple pumps and a logic unit. The first water box of the multiple water boxes is connected with the heat conductive pipe to form a loop circuit. When any pump stop running, the logic unit can control the pump to accelerate to maintain the recycling flow speed of the cooling reagent in the heat conductive pipe.

Description

technical field [0001] The invention provides a computer system, especially a computer system with a cooling module installed with multiple pumps. Background technique [0002] With the rapid development of science and technology, the speed of development of today's electronic devices such as computers and servers is also increasing day by day, especially the speed of progress in processors is astonishing. As the operating frequency of the processor is getting faster and faster, the heat generated by it is getting higher and higher. In order to maintain the processor of the electronic device in a high-frequency working environment with a limited volume This problem has become a bottleneck that urgently needs to be overcome today. [0003] Although there are many different heat dissipation methods on the market, the existing heat dissipation technology can no longer solve the heat generated by the processor and various components, so the application of many heat dissipation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 张弘
Owner MICRO-STAR INTERNATIONAL