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Heat dissipation device and electronic equipment with same

A heat dissipation device and electronic equipment technology, applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve problems such as liquid leakage, reduce product manufacturing costs, facilitate productization, and reduce occupied space Effect

Inactive Publication Date: 2019-07-26
阮琳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing solution needs to perform liquid filling and draining according to the actual use situation, and has many interfaces, so the problem of liquid leakage is prone to occur during maintenance and transportation

Method used

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  • Heat dissipation device and electronic equipment with same
  • Heat dissipation device and electronic equipment with same
  • Heat dissipation device and electronic equipment with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Without loss of generality, in this embodiment, the CPU chip of a personal PC is used as the main body of description of the power element, and the technical solution of the heat dissipation device proposed in this application is described in detail. In the case, the CPU chip is installed on the circuit board, and the heat dissipation device provided by the present application provides an effective solution for the heat dissipation treatment of the CPU chip 1 . It should be understood that the functional characteristics of the CPU chip 1 itself do not constitute a substantial limitation to the heat dissipation device described in this application.

[0033] See figure 1 and figure 2 , figure 1 It shows a schematic diagram of the overall structure of the heat dissipation device in Embodiment 1, figure 2 for figure 1 A-A sectional view of .

[0034] As shown in the figure, the heat dissipation device mainly includes three basic structures of a sealed housing box 2 ,...

Embodiment 2

[0046] Please also see image 3 and Figure 4 ,in, image 3 It is a schematic diagram of the overall structure of the heat dissipation device described in Embodiment 2, Figure 4 for image 3 BB sectional view of .

[0047] The basic composition and connection relationship of this solution are the same as those of the first embodiment, the main difference is that a heat-conducting support beam is added. In order to assist in explaining the substantive relationship between the two embodiments, for the same functional components, the related drawings use the same reference numerals to indicate them.

[0048] As shown in the figure, two heat-conducting beams are fixedly arranged on the outer surface of the housing box 2, which are respectively used to process other heating power elements beside the first chip 11: the second chip 12 and the third chip 13, wherein the first One heat-conducting support beam 61 and one end of the second heat-conducting support beam 62 are fixedl...

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PUM

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Abstract

The invention discloses a heat dissipation device. The heat dissipation device is used for heat dissipation processing of the power element of the electronic equipment and comprises a cooling medium sealing containing box and a fan, the cooling medium sealing containing box is filled with cooling media, the containing box is provided with a heat absorption surface used for being attached to the surface of the power element to be subjected to heat dissipation, and a plurality of heat dissipation fins are fixedly connected to the other surfaces of the containing box. And a working air flowing path of the fan covers the accommodating box. By applying the heat dissipation device, the heat dissipation processing of the functional element can be rapidly and effectively realized; on the basis ofmeeting the basic heat dissipation requirement, the occupied space of the heat dissipation component can be reduced to the maximum extent, and the product manufacturing cost is controllable. Safety and reliability are high, and installation, detection and transportation are convenient. The invention further provides electronic equipment with the heat dissipation device.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of power components, in particular to a heat dissipation device and electronic equipment with the heat dissipation device. Background technique [0002] Most electronic devices have power components that generate heat during operation, such as PC chips, host control boards, and the like. As we all know, the overheating of the above-mentioned power components as the main components of the equipment will directly affect the normal use of electronic equipment. Therefore, the effective heat dissipation of the power components is one of the key points to ensure the performance of the whole machine. [0003] At present, in addition to the fan heat dissipation technology, the evaporative cooling technology based on the boiling mechanism is applied in the heat dissipation treatment of power components. A typical solution is that it uses a component containing the cooling medium to exchange heat ...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 阮琳曹瑞罗元磊
Owner 阮琳